3D-Micromac shows novel laser processing solutions at Semicon West 2014
For the first time 3D-Micromac AG will present its microDICE™ laser dicing system and further innovative solutions for processing of semiconductors at Semicon West 2014.
San Francisco, CA. – July 7, 2014
3D-Micromac AG, a leading supplier of state-of-the-art laser micromachining workstations, will present novel laser applications for semiconductor industry at Semicon West 2014 in San Francisco, CA from July 8 to July 10, 2014.
For the first time, 3D-Micromac will show the high-performance microDICE™ laser dicing system which brings TLS-Dicing™ technology (Thermal-Laser-Separation) to semiconductor‘s back-end. The microDICE™ separates wafers, including SiC, into dies with an outstanding edge quality while increasing the yield and the throughput. Compared to traditional separation technologies microDICE™ provides a much higher process speed and better throughput enabling high-volume production of SiC based devices.
A further product highlight is the all-new microPREP™ workstation for laser-based sample preparation. It was developed to provide efficient laser micromachining fitted to the needs of microstructure diagnostics and failure diagnostics. Based on patented processing, 3D-Micromac’s microPREP™ is ready to do the laser cutting of a base structure followed by local laser thinning in an almost entirely automated fashion. Making use of a rugged pulsed laser source, the process is characterized by very low running costs, suitability for semiconductors, metals, ceramics, as well as compounds thereof, and a very high targeted precision on the micron scale.
microPREP™ is not just a tools to prepare samples for transmission electron microscopy but will come with options for atom-probe microscopy, tomography, transmission Kikuchi diffraction, and micromechanical testing. The modular stage and software design will allow to meet the growing requirements of clients and the market.
Furthermore, 3D-Micromac will show its high-efficient production system microSTRUCT™ OTF for photovoltaic industry. The microSTRUCT™ OTF is used for laser processing of mono- and polycrystalline silicon solar cells. Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the full-scale manufacturing of crystalline solar cells.
The microSTRUCT™ OTF can be combined with arbitrarily many laser sources to match the system exactly to the respective process requirements. Because of its modular structure the system is perfectly suited for laser processing of PERC solar cells, selective-emitter, LFC, MWT, and EWT cells.
All laser processing equipment made by 3D-Micromac meet the requirements of industrial production in case of highest precision, maximum throughput, low operating costs, and very high availability.
About 3D-Micromac AG
3D-Micromac AG has become one of the leading suppliers of highly efficient laser micromachining systems along with innovative coating and printing technologies on the international market since its foundation in 2002.
Stand-alone systems as well as entire production lines can be offered and are used, for example, in medical technology, the processing of semiconductors, in photovoltaics or the production of flexible electronic components. 3D-Micromac can also be your competent partner for the development of new technologies and processes or customized systems.
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