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3D-Micromac’s microDICE OTF system enables high-performance solar cell cutting into half cells

Improved average module power yield by use of Thermal-Laser-Separation (TLS) 3D-Micromac AG, the industry leader in laser micromachining, is going to introduce the brand-new microDICETM OTF system at SNEC 2015. The system uses Thermal-Laser-Separation for cutting of cells into half cells. By using half cell technology the average module power yield can be increased significantly.

Strategic reorganization for focussing on industrial target markets: 3D-Micromac sets the course for further growth

Since its founding 3D-Micromac AG has achieved a continuous growth. Due to the high specialization level of the systems and the advanced laser technology 3D-Micromac reached the market leadership in certain niches. To proceed on this successful way 3D-Micromac sets the course for a strategic reorganization in December 2014. A far stronger focus on growing […]

3D-Micromac introduces all-new system for high-throughput microdiagnostic sample preparation at ISTFA 2014

3D-Micromac AG, a leading supplier of state-of-the-art laser micromachining systems, introduces a novel laser system for high-throughput microdiagnostic sample preparation at ISTFA 2014 in Houston, Texas from November 11 to November 12, 2014. The all-new microPREP™ system for laser-based sample preparation was developed to provide efficient laser micromachining fitted to the needs of microstructure diagnostics […]

3D-Micromac America and Coherent, Inc sign collaborative agreement to provide high-precision test platform for micromachining applications

3D-Micromac America, LLC (3D-Micromac America) and Coherent, Inc. (Coherent) announced today that they have entered into an agreement where 3D-Micromac America will provide a state-of-the-art test platform to Coherent for micromachining and other precision laser applications development. In exchange, Coherent will help facilitate the localization of precision, laser-based motion system equipment for 3D-Micromac America, a […]

3D-Micromac shows novel laser processing solutions at Semicon West 2014

For the first time 3D-Micromac AG will present its microDICE™ laser dicing system and further innovative solutions for processing of semiconductors at Semicon West 2014. San Francisco, CA. – July 7, 2014 3D-Micromac AG, a leading supplier of state-of-the-art laser micromachining workstations, will present novel laser applications for semiconductor industry at Semicon West 2014 in […]