3D-Micromac AG, a leading supplier of state-of-the-art laser micromachining workstations, today introduced the microDICE™ system which brings TLS-Dicing™ technology (Thermal-Laser-Separation) to semiconductor‘s back-end. The microDICETM separates wafers, including SiC, into dies with an outstanding edge quality while increasing the yield and the throughput.
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3D-Micromac AG, a leading supplier of state-of-the-art laser micromachining workstations, has recently established 3D-Micromac America, LLC (“3D-Micromac America”) and opened a new office in Santa Clara, California to better serve the North American market. Brian Hoekstra, a laser industry veteran, will lead the newly formed company.