3D-Micromac expands international sales and service network
New sales and service partnerships in Asia augment 3D-Micromac AG’s international sales structure. Additionally the further development of 3D-Micromac America, LLC in the USA is being pushed ahead. In addition to the expansion of service capacity for the North American customer base, the formation of an application center is also planned.
3D-Micromac hosts well-established ILaCoS 2015 in Dresden, Germany
Experts in the field of micromachining meet at International Laser and Coating Symposium on October 7, 2015
3D-Micromac concludes successful tool demonstration at TSI
After 4 months of testing Topcell Solar International (TSI) determined that the 3D-Micromac PERC laser structuring tool microSTRUCT OTF is suitable for volume production and qualifies to TSI internal guidelines. The demo period was successfully closed with efficiencies meeting the internal baseline standard. Read more
3D-Micromac’s microDICE OTF system enables high-performance solar cell cutting into half cells
Improved average module power yield by use of Thermal-Laser-Separation (TLS)
3D-Micromac AG, the industry leader in laser micromachining, is going to introduce the brand-new microDICETM OTF system at SNEC 2015. The system uses Thermal-Laser-Separation for cutting of cells into half cells. By using half cell technology the average module power yield can be increased significantly.
3D-Micromac introduces all-new system for high-throughput microdiagnostic sample preparation at ISTFA 2014
3D-Micromac AG, a leading supplier of state-of-the-art laser micromachining systems, introduces a novel laser system for high-throughput microdiagnostic sample preparation at ISTFA 2014 in Houston, Texas from November 11 to November 12, 2014.
The all-new microPREP™ system for laser-based sample preparation was developed to provide efficient laser micromachining fitted to the needs of microstructure diagnostics and failure diagnostics. Based on patented processing, 3D-Micromac’s microPREP™ is ready to do the laser cutting of a base structure followed by local laser thinning in an almost entirely automated fashion. Making use of a rugged pulsed laser source, the process is characterized by very low running costs, suitability for semiconductors, metals, ceramics, as well as compounds thereof, and a very high targeted precision on the micron scale.
3D-Micromac America and Coherent, Inc sign collaborative agreement to provide high-precision test platform for micromachining applications
3D-Micromac America, LLC (3D-Micromac America) and Coherent, Inc. (Coherent) announced today that they have entered into an agreement where 3D-Micromac America will provide a state-of-the-art test platform to Coherent for micromachining and other precision laser applications development. In exchange, Coherent will help facilitate the localization of precision, laser-based motion system equipment for 3D-Micromac America, a subsidiary of Germany-based 3D-Micromac AG.
3D-Micromac shows novel laser processing solutions at Semicon West 2014
For the first time 3D-Micromac AG will present its microDICE™ laser dicing system and further innovative solutions for processing of semiconductors at Semicon West 2014.
San Francisco, CA. – July 7, 2014
3D-Micromac AG, a leading supplier of state-of-the-art laser micromachining workstations, will present novel laser applications for semiconductor industry at Semicon West 2014 in San Francisco, CA from July 8 to July 10, 2014.
For the first time, 3D-Micromac will show the high-performance microDICE™ laser dicing system which brings TLS-Dicing™ technology (Thermal-Laser-Separation) to semiconductor‘s back-end. The microDICE™ separates wafers, including SiC, into dies with an outstanding edge quality while increasing the yield and the throughput. Compared to traditional separation technologies microDICE™ provides a much higher process speed and better throughput enabling high-volume production of SiC based devices.
3D-Micromac enables high-performance and cost-effective dicing of SiC wafers
Product launch of microDICE™ laser dicing system using TLS-Dicing™ technology (Thermal-Laser-Separation) at Semicon West 2014
San Francisco, CA. – July 7, 2014
3D-Micromac AG, a leading supplier of state-of-the-art laser micromachining workstations, today introduced the microDICE™ system which brings TLS-Dicing™ technology (Thermal-Laser-Separation) to semiconductor‘s back-end. The microDICE™ separates wafers, including SiC, into dies with an outstanding edge quality while increasing the yield and the throughput.
3D-Micromac AG announces formation of 3D-Micromac America, LLC and enlists laser industry veteran to run U.S. operations
SAN JOSE, CA. JULY 1, 2014 / Business Wire
3D-Micromac AG, a leading supplier of state-of-the-art laser micromachining workstations, has recently established 3D-Micromac America, LLC (“3D-Micromac America”) and opened a new office in San Jose, California to better serve the North American market. Brian Hoekstra, a laser industry veteran, will lead the newly formed company.