New head of production at 3D-Micromac
Dr. Roland Giesen appointed as Chief Operation Officer
3D-Micromac AG recently won a major contract for a total of 27 microSTRUCTTM OTF machines for removal of the backside passivation on PERC cells. A leading global photovoltaics company awarded the contract to 3D-Micromac for the laser systems to equip its production facilities in Asia. With that the number of systems to be delivered to this customer rises to 36 units. The overall project is to be completed by the end of 2015.
New sales and service partnerships in Asia augment 3D-Micromac AG’s international sales structure. Additionally the further development of 3D-Micromac America, LLC in the USA is being pushed ahead. In addition to the expansion of service capacity for the North American customer base, the formation of an application center is also planned.
After 4 months of testing Topcell Solar International (TSI) determined that the 3D-Micromac PERC laser structuring tool microSTRUCT OTF is suitable for volume production and qualifies to TSI internal guidelines. The demo period was successfully closed with efficiencies meeting the internal baseline standard. Read more
3D-Micromac AG, the industry leader in laser micromachining, is going to introduce the brand-new microDICETM OTF system at SNEC 2015. The system uses Thermal-Laser-Separation for cutting of cells into half cells. By using half cell technology the average module power yield can be increased significantly.
3D-Micromac AG, a leading supplier of state-of-the-art laser micromachining systems, introduces a novel laser system for high-throughput microdiagnostic sample preparation at ISTFA 2014 in Houston, Texas from November 11 to November 12, 2014.
The all-new microPREP™ system for laser-based sample preparation was developed to provide efficient laser micromachining fitted to the needs of microstructure diagnostics and failure diagnostics. Based on patented processing, 3D-Micromac’s microPREP™ is ready to do the laser cutting of a base structure followed by local laser thinning in an almost entirely automated fashion. Making use of a rugged pulsed laser source, the process is characterized by very low running costs, suitability for semiconductors, metals, ceramics, as well as compounds thereof, and a very high targeted precision on the micron scale.