The progressive miniaturization in electronics, semiconductor processing and manufacturing of medical instruments is characterised by smaller and smaller structures as well as the demand for highest precision in terms of surface quality, absence of burr, and materials residues. While established fabrication technologies increasingly face their limits, laser micromachining provides optimum preconditions for the required quality and precision since machining is accomplished in a contactless fashion and the extent of the heat-affected zone is very small.
Classical application areas lie within the ambit of the laser micro drilling, laser fine cutting, laser micro structuring and the laser micro engraving. Moreover, innovative laser separation processes such as TLS-Dicing or laser ablation processes for the manufacturing of cylindrical holes, undercut geometries or molds are finding their way into the industrial production.
With laser-based sample preparation, 3D-Micromac opens a new field of application for laser micromachining. Patented workflows for TEM analysis, X-ray microscopy, atom probe tomography, and micro mechanical testing complement existing approaches to sample preparation such as focused ion beam (FIB) micromachining, offering up to 10,000 times higher ablation rates and therefore an order of magnitude lower cost of ownership (CoO) compared to FIB.
In additive manufacturing, Micro Laser Sintering combines the advantages of 3D printing and micro machining for the first time. Micro metal parts of incredible accuracy, detail resolution and surface quality are manufactured this way.