EPOS

The Target of the EPOS-project involve research and development of material and energy efficient R2R-process technologies for atmospheric (without vacuum) processing of semitransparent organic photovoltaics.

Project Partners

  • 3D-Micromac AG, Chemnitz, Germany
  • Bergische Universität Wuppertal, Germany
  • EXAKT Advanced Technologies GmbH, Norderstedt, Germany
  • Fraunhofer Institut für angewandte Polymerforschung, Potsdam, Germany
  • KSG Leiterplatten GmbH, Gornsdorf, Germany
  • LayTec in-line GmbH, Berlin, Germany
  • PUMA SE, Herzogenaurach, Germany
  • Sächsische Walzengravur GmbH, Frankenberg, Germany
  • Technische Universität Braunschweig, Institut für Hochfrequenztechnik, Germany
  • Technische Universität Chemnitz, Germany

This project has received funding from the Federal Ministry of Education and Research under grant agreement no [03EK3529A].

Approval period:
01.09.2014 to 28.02.2018

OptiPerm

In frame of the OptiPerm project will be carried out baseline investigations and the concept development of a R2R system with integrated electron beam source for creation of barrier films on flexible substrates.

Project Partners

  • VON ARDENNE GmbH, Dresden, Germany
  • 3D Micromac AG, Chemnitz, Germany
  • GfE Fremat GmbH, Freiberg, Germany
  • IOT GmbH, Leipzig, Germany
  • Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., München, Germany
  • Fraunhofer-Institut für Organische Elektronik, Elektronenstrahl- und Plasmatechnik, Dresden, Germany

This project has received funding from the European Regional Development Fund (ERDF) under grant agreement no [100235463].

Approval period:
15.09.2015 to 14.09.2018

SAM³

More-than-Moore (MtM), System-in-Package (SiP), as well as 3D high-density integration technologies are a prerequisite for enabling the design of compact microelectronic devices e.g. needed for future smart cities. Target of this project is to explore and to develop new diagnostic tools and advanced methods for material characterization, defect localization, efficient sample preparation, physical failure analysis techniques and workflows to enable reliable advanced micro-systems based on MtM, SiP, and 3D technologies for European core applications. The four major European semiconductor and system suppliers Infineon, STMicroelectronics, Bosch and Thales will collaborate with eleven equipment and analytical method suppliers from Germany and France. The work is supported by five academic institute partners. This collaboration will strengthen the competitiveness of the semiconductor and system suppliers to design innovative MtM and SiP products in respect to reliability, quality, cost and shorter time to market to ensure leadership in a global perspective. The project will also support European analytical equipment providers, many of them SME, to explore new market opportunities, design new equipment, and to align their developments to future needs of new system integration technologies.

Project Partners

German consortium

  • Infineon Technologies AG, Regensburg, Germany
  • Robert Bosch GmbH, Reutlingen, Germany
  • 3D-Micromac AG, Chemnitz, Germany
  • MUEGGE GmbH, Reichelsheim, Germany
  • NanoWorld Services GmbH, Erlangen, Germany
  • PVA TePla Analytical Systems GmbH, Westhausen, Germany
  • point electronic GmbH, Halle (Saale), Germany
  • WITec GmbH, Ulm, Germany
  • Fraunhofer Institut für Werkstoffmechanik Halle, Halle (Saale), Germany
  • Reutlingen University, Reutlingen, Germany
  • SmarAct GmbH, Oldenburg, Germany

French consortium

  • STMicroelectronics, Grenoble, Rousset and Tours, France
  • Thales Systèmes Aéroportés and Thales Research and Technology, France
  • Digit Concept, Secqueville-en-Bessin, France
  • Orsay Physics, Fuveau, France
  • Tours University Greman, Tours, France
  • CNRS– DR12 (LP3), Marseille, France

This project has received funding from the Federal Ministry of Education and Research under grant agreement no [16ES034].

Approval period:
01.10.2015 to 31.12.2018

SOLAR-TLS

A main aspect in technological developments for photovoltaics is the reduction of cost per power of the solar panel. This can be achieved by increasing the „cell-to-module“(CTM) key performance indicator, e.g. by reduction of losses. Through dividing the solar cells in half cells before integrating in modules electrical losses can be reduced. Furthermore a technology for cutting solar cells is especially interesting for national producers of special solar modules who can use it for the production of special formed modules.
The aim of the project SOLAR-TLS is the development of an industrial usable process for cutting solar cells based on „thermal laser separation“(TLS). The main goal is to separate the cells without inducing damage at the cutting edge. The electrical and mechanical properties of the cells after cutting are in the focus of the investigations. Those properties should be unchanged after cutting. Therefore TLS is a promising approach as TLS dicing works without remove of material and create a smooth cut nearly without deterioration. This should lead to an increased lifetime of the solar modules.

Project Partners

  • 3D-Micromac AG, Chemnitz, Germany
  • Hörmann ITS Cell GmbH, Kabelsketal, Germany
  • Fraunhofer-Center für Silizium-Photovoltaik, Halle, Germany
  • Hochschule Anhalt, Köthen, Germany

This project has received funding from the Federal Ministry for Economic Affairs and Energy under grant agreement no [0325893A].

Approval period:
01.05.2016 to 31.10.2018

POLDI

The target of the POLDI_plus project is the development of processes for economic production of high efficiency emitters with low charge carrier recombination.

Thereto the project part of 3D-Micromac will provide an important contribution: equipment and process development, process integration into the PERC process as well as cost calculation.

Approaches for the further substantial increase of the throughput should be developed with respect to the equipment. All components have to be adapted to the requirements of the new high efficiency laser processes. At the end of the project a throughput of 5000 Wafer per hour should be reached. Firstly the developments are oriented to the state of the art. Approaches for precise local laser doping based on lean equipment concepts should be developed as well as a process based on a cost efficient infrared laser source. At the end of the project the equipment should allow the aligning of the selective emitter to the printed electrode with a precision of+/-10 μm.

Project Partners

  • Fraunhofer Institut für Solare Energiesysteme (ISE), Freiburg, Germany
  • Centrotherm photovoltaics AG, Blaubeuren, Germany
  • 3D-Micromac AG, Chemnitz, Germany
  • Amphos GmbH, Herzogenrath, Germany

This project has received funding from the Federal Ministry for Economic Affairs and Energy under grant agreement no [0324079C].

Approval period:
01.09.2016 to 31.08.2019

BIPVpod

The outcome of this project should be a set of processing methods that will allow production of customer tailored ‘panels on demand’ with specified PV panel dimensions and color for small production batches and low added costs. The ‘panel on demand’ technology will be developed, prototyped and field tested in building elements. This opens up a huge variety of possibilities and niche applications for BIPV. In order to investigate the potential of the technology, three different BIPV applications for the ‘panels on demand’ will be developed: A façade system, a roof system for new built houses and a roof system for renovation of houses.

Project Partners

German consortium

  • Coordinator: NEXT ENERGY EWE-Forschungszentrum für Energietechnologie e.V.
  • Project partners:
    • 3D-Micromac AG, Chemnitz
    • Forschungszentrum Jülich GmbH

Dutch consortium

  • Aerspire (AER) SEMCOglas Holding (SEM)
  • Wallvision (WV) Zonnepanelen Parkstad (ZP) Energy Research Centre of the Netherlands (ECN)
  • Nederlandse Organisatie voor toegepastnatuurwetenschappelijk onderzoek (TNO)

Grant agreement no: 0324130C

Approval period:
01.06.2017 to 31.05.2020

POSITION-II

POSITION-II – “A pilot line for the next generation of smart catheters and implants”

It is the ambition of the POSITION-II project to enable innovation in Smart Catheters and Implants by the introduction of open technology platforms for: miniaturization, in-tip AD conversion, wireless communication, MEMS transducer technology and encapsulation. These platforms are open to multiple users and for multiple applications.

3D-Micromac will provide in frame of POSITION-II precise laser micro processing of small parts for Smart Catheters and Implants.

Project Partners

  1. ‘the coordinator’: PHILIPS ELECTRONICS NEDERLAND B.V. (PEN), Netherlands
  2. PHILIPS MEDICAL SYSTEMS NEDERLAND BV (PMS), Netherlands
  3. TECHNISCHE UNIVERSITEIT DELFT (TUD), Netherlands
  4. SALVIA BIOELECTRONICS BV (SAL), Netherlands
  5. TECHNISCHE UNIVERSITEIT EINDHOVEN (TU/e), Netherlands
  6. REDEN B.V. (RED), Netherlands
  7. Catena Holding BV (CAT-NL), Netherlands
  8. COMMISSARIAT A L ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (CEA), France
  9. VERMON SA (VER), France
  10. PHILIPS FRANCE COMMERCIAL (PRP), France
  11. MURATA INTEGRATED PASSIVE SOLUTIONS (MUR), France
  12. OKMETIC OY (OKM), Finland
  13. Teknologian tutkimuskeskus VTT Oy (VTT), Finland
  14. TIKITIN OY (TIKITIN), Finland
  15. AALTO KORKEAKOULUSAATIO SR (AALTO), Finland,
  16. FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG e.V. (Fraunhofer), Germany
  17. OSYPKA AG (OSY), Germany
  18. FINETECH GMBH & CO KG (FINE), Germany
  19. AMIC ANGEWANDTE MICRO-MESSTECHNIK GMBH (AMIC), Germany
  20. INSTITUT FUER MIKROELEKTRONIK STUTTGART (IMS), Germany
  21. MULTI CHANNEL SYSTEMS MCS GMBH (MCS), Germany,
  22. JOHNSON MATTHEY PIEZO PRODUCTS GMBH (JMPP), Germany
  23. CATENA GERMANY GMBH (CAT-DE), Germany
  24. 3D-Micromac AG (3DM), Germany
  25. CORTEC GMBH (CTC), Germany
  26. Dyconex AG (DYC), Switzerland
  27. UNIVERSITY COLLEGE CORK – NATIONAL UNIVERSITY OF IRELAND, (TYN), Ireland
  28. ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY (ADI), Ireland
  29. BRIVANT LIMITED (BLT), Ireland
  30. CREGANNA UNLIMITED COMPANY (CGM), Ireland
  31. SILEX MICROSYSTEMS AB (SIL), Sweden
  32. INSTITUTO DE TELECOMUNICACOES (ITAV), Portugal
  33. PDM E FC PROJECTO DESENVOLVIMENTO MANUTENCAO FORMACAO E CONSULTADORIALDA (PDM), Portugal
  34. INESC ID – INSTITUTO DE ENGENHARIADE SISTEMAS E COMPUTADORES, INVESTIGACAO E DESENVOLVIMENTO EM LISBOA (INESC), Portugal
  35. BRIO APPS ALPHASIP S.L. (ASIP), Spain
  36. CONSORCIO CENTRO DE INVESTIGACION BIOMEDICA EN RED M.P. (CIBER), Spain
  37. CIKAUTXO S COOP (CIKAUTXO), Spain
  38. FUNDACION CENTRO DE CIRUGIA DE MINIMA INVASION JESUS USON (CCMIJU), Spain
  39. UNIVERSIDAD DE ZARAGOZA (UNIZAR), Spain
  40. UNIVERSIDAD COMPLUTENSE DE MADRID (UCM), Spain
  41. INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM (IMEC), Belgium
  42. MAGYAR TUDOMANYOS AKADEMIA ENERGIATUDOMANYI KUTATOKOZPONT (EK-MFA), Hungary
  43. MAGYAR TUDOMANYOS AKADEMIA TERMESZETTUDOMANYI KUTATOKOZPONT (MTATK), Hungary
  44. UNIVERSITA DEGLI STUDI ROMA TRE (USRT), Italy
  45. FONDAZIONE BRUNO KESSLER (FBK), Italy

The Position-II project has received funding from the European Union’s Horizon 2020 research and innovation programme (ECSEL JU) under grant agreement no [783132].

Approval period:
01.06.2018 to 31.05.2020

LAOLA

The project aims to develop large-scale lighting applications using organic light-emitting diodes (OLEDs) on flexible substrates. The focus here is on thin glass, which offers advantages over plastic as a substrate due to its outstanding barrier properties. For the production in the roll-to-roll process, the winding processes of the thin glass substrate must first be integrated to the coating unit. As a further challenge, laser cutting and structuring processes are developed for substrate separation and interconnection. In addition work will directed to efficient protective coatings for the OLEDs as well as to transparent electrical contacts which give added value to the lighting market. As a result of the project, demonstrators are being developed that illustrate the power of the technology. Some of the technologies are being researched in cooperation with cooperation partners from the partner cluster in Yonezawa, Japan. The entire project is coordinated by Organic Electronics Saxony (OES). With the provision of the technology for crack-free separation of thin glass laminates, the 3D-Micromac AG is an important partner in the project. Website LAOLA

Sponsored Partners:

  • Fraunhofer-Institut für Organische Elektronik, Elektronenstrahl- und Plasmatechnik (FEP)
  • FHR Anlagenbau GmbH
  • CREAVAC-Creative Vakuumbeschichtung GmbH
  • WOLFRAM Design/Engineering
  • Heliatek GmbH
  • Organic Electronics Saxony Management GmbH

Associated Partners:

  • 3D-Micromac AG
  • CreaPhys GmbH
  • tesa SE

Approval period:: 01.08.2018 to 31.07.2021