Semiconductor Industry

Cost, quality and throughput are major factors in achieving successful manufacturing in the semiconductor industry. With the growing adoption of new types of wafer substrates, thinner wafers and scaling to smaller dimensions and larger-size substrates, wafer dicing is evolving as a critical value-add process step that not only ensures, but also further enhances, semiconductor device yields.

3D-Micromac meets this need with its microDICE™ laser micromachining system leveraging TLS-Dicing™ (thermal laser separation) – a unique technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs), into dies with outstanding edge quality while increasing manufacturing yield and throughput. Compared to traditional separation technologies, such as saw dicing and laser ablation, TLS-Dicing enables a clean process, micro-crack-free edges, and higher resulting bending strength.

Capable of dicing speeds up to 300 mm per second, the microDICE system provides up to a 30X increase in process throughput compared to traditional dicing systems. Its high throughput, outstanding edge quality and 300-mm wafer capable platform enables a true high-volume production process, especially for SiC-based devices.

In addition, microDICE reduces the dicing cost per wafer by up to an order of magnitude or more compared to other wafer dicing approaches. Due to the contactless laser machining method, there is no tool wear and no expensive consumables are required. This results in excellent cost of ownership during the entire life-time of the dicing system.

More information is available in Chip Scale Review November/December 2016; Volume 20, Number 6 and on our website:

microDICE™ TLS – Laser Dicing System

microDICE™ TLS – Wafer Dicing System using Thermal Laser Separation (TLS™ -Dicing)