Publications


2017


Laser Technik Journal, Issue 1/2017

René Liebers, Mandy Gebhardt


2016


Shop Floor Lasers November/December Issue 2016

Drilling Down

Thomas Gester, Mandy Gebhardt

Chip Scale Review November/December 2016; Volume 20, Number 6

Dicing silicon carbide power devices using thermal laser separation

Hans-Ulrich Zuehlke, Mandy Gebhardt

TAP TIMES, November 2016, No. 11, Vol. 7

A new wafer-dicing approach for silicon carbide devices

Hans-Ulrich Zuehlke, Mandy Gebhardt


2015


SNEC Conference 2015

PV Cell separation by Thermal Laser Separation

Hans-Ulrich Zuehlke1),Thomas Kiessling1), Kai Kaufmann2), Norbert Bernhard2,3), Marko Turek3), Felix Kaule3), Stephan Schoenfelder3), Joerg Bagdahn2,3), Dirk Lewke4)  1) 3D-Micromac AG, 2) Anhalt University of Applied Sciences, 3) Fraunhofer Center for Silicon Photovoltaics CSP, 4) Fraunhofer Institute for Integrated Systems and Device Technology IISB

Global Solar Magazine, Volume 7

Laser Processes for Increasing the Efficiency of Solar Cells and Solar Modules

Thomas Kiessling, Mandy Gebhardt

Laser Technik Journal, Issue 1/2015

A Novel Laser Tool for High-Volume Sample Preparation

Thomas Höche, Michael Krause, Martin Ebert and Uwe Wagner


2014


Laser Technik Journal, Vol. 11, Issue 1

Laser Contact Opening of High Efficient Solar Cells

Mandy Gebhardt, Thomas Kießling and Michael Grimm

MRS Spring Meeting 2014

High Quality and high Speed cutting of 4H-SiC JFET Wafers including PCM structures by using thermal laser Separation

Dirk Lewke, Matthias Koitzsch, Martin Schellenberger, Lothar Pfitzner, Heiner Ryssel, Fraunhofer Institute for Integrated Systems and Device Technology (IISB)

In: Proceedings of 2014 MRS Spring Meeting.


2013


Laser Technik Journal, Vol. 10, Issue 1

Laser Structuring of Flexible Organic Solar Cells

Mandy Gebhardt, Jens Hänel, Dr. Frank Allenstein, Christian Scholz and Maurice Clair

ASMC 2013

Improving electric behavior and simplifying production of Si-based diodes by using thermal laser separation

Koitzsch, M. et al.

In: Proceedings of ASMC 2013.


2012


Future Fab 2012, Issue 42

Thermal Laser Separation and Its Applications

Dirk Lewke, Matthias Koitzsch, Martin Schellenberger, Lothar Pfitzner, Heiner Ryssel, Fraunhofer Institute for Integrated Systems and Device Technology (IISB)
Hans-Ulrich Zühlke, Jenoptik Automatisierungstechnik GmbH

MRS Spring Meeting 2012

Ablation Free Dicing of 4H-SiC Wafers with Feed Rates up to 200 mm/s by Using Thermal Laser Separation

Lewke, D., M. Koitzsch, M. Schellenberger, L. Pfitzner, H. Ryssel, H.-U. Zühlke

In: Proceedings of MRS Spring Meeting, Symposium: Silicon Carbide Materials, Processing and Devices, 2012

ISCDG 2012

Advanced Vacuum Wafer Dicing for Thermal Laser Separation

O. Le-Barillec, M. Davenet, A. Favre, B. Bellet, adixen Vacuum Products, Annecy, France

M. Koitzsch, D. Lewke, M. Schellenberger, Fraunhofer IISB, Erlangen, Germany

H-U. Zühlke, JENOPTIK, Jena, Germany

CSSC6 2012

Thermal Laser Separation – Damage-free and  Kerfless Cutting of Wafers and Solar Cells

Koitzsch, M. et. al.

In: Proceedings of The 6th International workshop on Crystalline Silicon for Solar Cells, October 8-11, 2012, Aix-les-Bains, France

ASMC 2012

Enhancements in resizing single crystalline silicon wafers up to 450 mm by using thermal laser separation

M. Koitzsch, D. Lewke, M. Schellenberger, L. Pfitzner, H. Ryssel, H.-U. Zühlke

In: Proceedings of ASMC 2012, Saratoga Springs, 2012.