microCELL™ Product Family


Laser Systems for Processing Silicon Solar Cells


The microCELL™ production solutions, such as high performance laser processing for Laser Contact Opening (LCO) of high efficient PERC solar cells as well as laser dicing of full cells into half cells with Thermal Laser Separation (TLS-Dicing™), are designed to meet cell manufacturers‘ demands for achieving maximum throughput rates and yield while diminishing cell manufacturing costs.



3D-Micromac‘s microCELL™ TLS is a highly productive laser system for separation of standard silicon solar cells into half cells. The microCELL™ TLS meets cell manufacturers‘ demands by retaining the mechanical strength of the cut cells.

The ablation free process guarantees an outstanding edge quality. Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the full-scale manufacturing of crystalline half cells.


microCELL™ TLS offers:

  • On-the-fly laser processing with unbeatable
    cost-benefit ratio
  • One-pass contactless dicing process
  • High throughput > 5,000 wph on single lane
  • Dicing speed up to 300 mm/sec
  • Low cost of ownership and CAPEX
  • Inline integration into existing production lines

Configuration packages


Stand-alone

  • Two working areas on single lane for initial scribing and TLS cleaving
  • Handler-tool-in for full cells and handler-tool-out for half cells

Inline

  • Two working areas on single lane for initial scribing and TLS cleaving
  • Inline system for complete integration into existing production lines

Options

  • Breakage control / NIO discharge
  • RFID reader
  • Data matrix reader (DMC)
  • Wafer buffer system
  • MES system
  • Loading and unloading handling as on customer specification



3D-Micromac‘s microCELL™ OTF is a highly productive laser system for processing of mono- and polycrystalline silicon solar cells. The microCELL™ OTF meets cell manufacturers‘ demands for increasing the efficiency, e.g. of PERC solar cells, by precise surface structuring, low operating costs, and highest availability.

Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the mass production of crystalline solar cells. The contactless cell handling enables processing without surface defects and microcracks.


microCELL™ OTF offers:

  • On-the-fly laser processing with unbeatable
    cost-benefit ratio
  • Contactless wafer handling
  • High throughput and efficiency (> 3,800 wph)
  • Low cost of ownership and CAPEX
  • Upgrade for existing production lines or expansion

Configuration packages


Stand-alone

  • High on duty of the laser > 98%
  • Handler-tool-in and handler-tool-out for maximum throughput

Inline

  • High on duty time of the laser > 98 %
  • Inline system for complete integration into existing production lines, e.g. in front of printing machine

Options

  • Breakage control / NIO discharge
  • RFID reader
  • Data matrix reader (DMC)
  • Wafer buffer system
  • MES system
  • Loading and unloading handling as on customer specification



3D-Micromac‘s microCELL™ OTF Dual Lane is a highly productive laser system for processing of mono- and polycrystalline silicon solar cells. The microCELL™ OTF Dual Lane meets cell manufacturers‘ demands for increasing the efficiency, e.g. of PERC solar cells, by precise surface structuring, low operating costs, and highest availability.

Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the mass production of crystalline solar cells.


microCELL™ OTF Dual Lane offers:

  • On-the-fly laser processing with unbeatable cost-benefit ratio
  • High throughput and efficiency (> 8,000 wph)
  • Low cost of ownership and CAPEX
  • Upgrade for existing production lines or expansion
  • Easy accessible for servicing

Configuration packages


Inline

  • High on duty time of the laser > 98 %
  • Inline system for complete integration into existing production lines, e.g. in front of printing machine

Options

  • Breakage control / NIO discharge
  • RFID reader
  • Data matrix reader (DMC)
  • Wafer buffer system
  • MES system
  • Loading and unloading handling as on customer specification

Please contact us for more information!

Thomas Goldschmidt
Head of Sales

Tel: +49 371 40043-222
sales@3d-micromac.com