microPREP™

Laser-Based Sample Preparation for Microstructure Diagnostics

The all-new microPREP™ system was developed to provide efficient laser sample preparation fitted to the needs of microstructure diagnostics and failure diagnostics.

It allows to create complex and 3D-shaped samples to enable more comprehensive analysis of certain structures like in advanced packages, such as through silicon vias (TSVs), or even complete systems-in-package (SiP). Furthermore, it is ideal to provide larger-sized samples with micron-level precision having virtually no structural damage and no elemental contamination by pico-second laser processing.

The modular software design of microPREP™ ensures high flexibility for machining of samples for a broad range of microstructure diagnostics techniques. Besides the provision of parameter-setups (recipes) and the capability to mark samples for easy tracking, this novel approach features three orders of magnitude higher ablation rates in comparison to purely ion-beam-based processes.

Through the ongoing development microPREP™ is now suitable for Scanning Electron Microscopy (SEM), Transmission Kikuchi diffraction (TKD) , Transmission Electron Microscopy (TEM), X-ray Microscopy (XRM), Atom-Probe Tomography (APT), micromechanical testing and other application which can be supported by a high laser ablation.

For high-volume sample preparation or even to avoid an additional cleaning process the microPREP™ PRO is additional available with overview camera and a CO2 Snow Jet Cleaning which helps to reduce the time to sample.

Contact

Please contact our technical sales team for more information.

Boris Rottwinkel
Tel: +49 371 40043-222
sales@3d-micromac.com

Scientific Publications

2018

TEM sample preparation workflow using laser ablation and broad ion beam milling.
2018, Poster, IMC19 – (Takanori Sato, Jacob Byrnes), Australian Centre for Microscopy & Microanalysis, The University of Sydney.

A combined laser ablation/focused ion beam approach to atom probe sample preparation.
2018, Poster, IMC19 – (Jacob Byrnes, Ingrid McCarroll, Katja Eder, Limei Yang, Julie Cairney), The University of Sydney.

Rapid and localized ion-beam etching of surfaces using initial notches
2018,  Micron – (Busch, R.; Krause, M.; Coyle, S.; Höche, T.).

An Evaluation of Beam-Damage Zone in Si Wafer Machined by Gatan MicroPREPTM Laser-Ablation
2018, Microscopy and Microanalysis – (Zhao, W.; Bennett, C.; Sairam Pichumani, R.; Walker, G.; Eaton, K.; Hassel Shearer, M.; Dumas, L.; Brooks, I.; Wang, Y.).

A New, Efficient Method for Preparation of 3D Integrated Systems by Laser Techniques
2018, IEEE 68th ECTC – (Klengel, R.; Klengel, S.; Schusser, G.; Krause, M.).

Nanoscale 3D X-ray Microscopy for High Density Multi-Chip Packaging FA
2018, ISTFA – (Schmidt, C.).

2017

Combination of precise laser and FIB milling for TEM based IC failure analysis
2017, ESREF – (F. Altmann, M. Simon-Najasek, S. Hübner, M. Lejoyeux).

Pico-Second Laser and Broad Argon Beam Tools for Characterization of Advanced Packages and Devices
2017, ISTFA – (Hassel Shearer, M.).

Pico-Second Laser and Broad Argon Beam Tools For Characterization Of Advanced Packages And Devices
2017, EFUG Workshop – (Richard, V.;Hassel Shearer, M.).

Novel sample preparation and High-Resolution X-ray tomography for Package FA
2017, IPFA – (Schmidt, C.; Kelly, S. T. ; Ying Wang ; S. T. Coyle ; Michael Hassel Shearer).

2016

Laser based sample preparation for advanced packaging application
2016, EFUG – (Höche, T.; Krause, M.).

microPREP: A new laser tool for high-volume sample preparation
2016, IPFA Manuscript – (Wagner, U.; Petsch, T.; Krause, M.; Höche, T.).

2015

A Novel Laser Tool for High-Volume Sample Preparation
2015, Laser-Technik-Journal (Thomas Höche , Michael Krause , Martin Ebert , Uwe Wagner , Mandy Gebhardt).

New Approach of Laser Processing of Transparent Materials
2015, Lasers in Manufacturing Conference – (Werner, M.; Zimny, R.; Grimm, M.).

2014

microPREP – a new laser tool for high-throughput sample preparation
2014, 40th ISTFA (Krause, M.; Ebert, M.; Höche, T.; Wagner, U.).