microPRO™ RTP

Selective Laser Annealing System for Semiconductor Applications

The microPRO™ RTP, a new laser annealing system designed to enable several key process steps in semiconductor, power device and MEMS manufacturing, combines a state-of-the-art laser optic module with 3D-Micromac’s modular semiconductor wafer manufacturing platform. It provides selective annealing with high repeatability and throughput in a versatile system. The microPRO™ RTP features a line scan option for vertical selective annealing and a step-and-repeat spot option for horizontal selective annealing, as well as three optional laser wavelengths.

The microPRO™ RTP can address a wide variety of existing and emerging applications, including:

  • Giant magneto resistive (GMR) and tunneling magneto resistive (TMR) sensor manufacturing 
  • Ohmic contact formation in silicon carbide (SiC) power devices to improve resistance
  •  Dopant activation for insulated gate bipolar transistors (IGBTs), as well as activation of backside illuminated (BSI) CMOS image sensors and amorphous silicon (a-Si)

microPRO™ RTP offers:

  • High precision and repeatability in both X and Y directions
  • High selectivity to different substrates and films, with multiple options for laser pulse length, energy and overlap to ensure no damage to the
    area surrounding the target site
  • Very high energy homogeneity
  • Precise process monitoring
  • Flexibility to handle substrate diameters ranging from 50 mm up to 300 mm

Please contact us for more information!

Jan Klinger
Head of Sales and Product Management

+49 (0)371 40043-66 / -228

Das Team Sales & Product Management