The microPRO™ RTP, a new laser annealing system designed to enable several key process steps in semiconductor, power device and MEMS manufacturing, combines a state-of-the-art laser optic module with 3D-Micromac’s modular semiconductor wafer manufacturing platform. It provides selective annealing with high repeatability and throughput in a versatile system. The microPRO™ RTP features a line scan option for vertical selective annealing and a step-and-repeat spot option for horizontal selective annealing, as well as three optional laser wavelengths.
The microPRO™ RTP can address a wide variety of existing and emerging applications, including:
- Giant magneto resistive (GMR) and tunneling magneto resistive (TMR) sensor manufacturing
- Ohmic contact formation in silicon carbide (SiC) power devices to improve resistance
- Dopant activation for insulated gate bipolar transistors (IGBTs), as well as activation of backside illuminated (BSI) CMOS image sensors and amorphous silicon (a-Si)