August 31st – September 4th, 2026

IMC21 2026

IMC21 is the only truly global microscopy conference, bringing together thousands of delegates, high-level speakers, and representatives from the national microscopy associations. Microscopy professionals, microscopy associations, policymakers, and companies will meet to share the latest findings and best practices in microscopy research. Participants include engineers, scientists, educators, and other microscopy professionals, as well as government representatives, representatives from IMC member associations.

At the accompanying trade fair, we are presenting our laser-based sample preparation system microPREP PRO.

We look forward to seeing you at booth 328!

Event location:

ACC Liverpool, UK

Impact of Laser Sample Prep on Microstructure Diagnostics Workflows

Watch our free webinar on “Impact of Laser Sample Prep on Microstructure Diagnostics Workflows”

Discover how 3D-Micromac’s cutting-edge tools, microPREP PRO and microPREP PRO FEMTO, are enhancing sample preparation for researchers and diagnostic laboratories.

Why should you attend?

• Learn how to reduce sample preparation time from hours to minutes
• Explore the benefits of femtosecond laser technology for virtually damage-free sample preparation
• Understand how to prepare complex 3D-shaped samples for comprehensive analysis
• Gain insights into improving efficiency in APT, SEM, TEM, and XRM applications

Key highlights:

• Q&A session with Prof. Dr. Thomas Höche (Fraunhofer IMWS)
• Exclusive look at automated workflows for a wide range of sample prep tasks
• Discussion on laser machining of inorganic materials (metals, semiconductors, ceramics, glasses)

Speaker: Prof. Dr. Thomas Höche, Head of Business Unit Optical Materials and Technologies, Fraunhofer Institute for Microstructure of Materials and Systems IMWS

Don’t miss this opportunity to stay at the forefront of materials science innovation!

19th – 20th May, 2026

CAM-Workshop 2026

On May 19th and 20th, 2026, we will present our microPREP PRO system for sample preparation at the 13th CAM-Workshop in Halle.

The CAM-Workshop brings together experts from the electronics industry and manufacturers of material diagnostic devices. The aim is to discuss challenges, innovative solutions, and future requirements in failure analysis and material characterization of electronic devices, sensors, and systems.

Learn all about laser-based sample processing for microstructure diagnostics during a visit to our booth no. 001.

We look forward to seeing you at our booth!

Venue: Leibniz IAMO, Theodor-Lieser-Straße 2, Halle, Germany

Booth: 001

Watch our free webinar on “Introduction to the New Large Volume Workflow for Semiconductor Advanced Packaging Failure Analysis”

Join us for an insightful webinar where we will introduce a groundbreaking synergistic workflow, merging plasma Focused Ion Beam (FIB) technology with high-speed laser ablation using the 3D-Micromac microPREP® PRO. FIB technology, renowned for its precision and versatility, enables detailed imaging and precise material removal at the nanometer scale. When combined with high-speed laser ablation, this powerful integration significantly accelerates analysis processes and enhances precision.

In this webinar we will show general approaches for:

• Synergistic workflow combining plasma FIB technology and high-speed laser ablation technique (microPREP® PRO)
• Analysis process and enhanced precision of results
• Challenges in identifying defects buried deep under surfaces in advanced packaging technologies

Additionally, you get the latest update of the TESCAN Large Volume Workflow, developed in collaboration with industrial partners from the European FA4.0 project

• New shared sample holder compatible with various defect localization instruments
• Essence AutoSection™ software for automated sample holder alignment and ROI identification

Who Should Attend?

This webinar is ideal for professionals and users in the following fields:

• Semiconductor research and development
• Failure analysis and quality assurance
• Packaging technology
• High-tech industries requiring precise and fast analysis processes

Presenter: Lukas Hladik, Product Marketing Manager at TESCAN Group, has specialized in Plasma FIB-SEM and failure analysis solutions. His work is closely linked with the global semiconductor industry.

Femtosecond laser ablation-based preparation methods for high resolution materials characterization

Watch our free webinar on “Femtosecond laser ablation-based preparation methods for high-resolution materials characterization”

Are you ready to revolutionize your specimen preparation processes? We are excited to present you a webinar featuring Dr. Tkadletz from Montanuniversität Leoben, who will explore the latest advancements in integrating modern specimen preparation equipment for transmission electron microscopy (TEM) and atom probe tomography (APT). This webinar will provide insights into how these modern specimen preparation techniques can significantly reduce complexity, improve efficiency, and facilitate faster and more effective investigations in materials research.

Our partner, Rave Scientific, is hosting the webinar.

Key Highlights:

• Cutting-Edge Integration: Discover how combining fs-laser ablation systems like the 3D-Micromac microPREP PRO FEMTO with focused (FIB) and broad (BIB) ion-beam polishing devices sets new standards in specimen preparation.
• Efficiency and Flexibility: Learn about the significant advantages of reduced effort, exceptional time efficiency, and flexibility in designing specimen geometries such as discs, half-grids, microtip arrays, and whole sample holders.
• Rapid Pre-Preparation: Understand how fs-laser ablation enables the rapid pre-preparation of TEM and APT specimens, often within minutes, streamlining the final preparation steps.
• Advanced Techniques: Explore the integration of complementary techniques like electron backscatter diffraction, energy dispersive X-ray spectroscopy, and FIB secondary ion mass spectroscopy for site-specific preparation.
• Eliminating Conventional Steps: See how modern techniques eliminate the need for FIB lift-outs and conventional dimple grinding, optimize materials research workflows, and enhance specimen throughput.

Speaker: Dipl.-Ing. Dr.mont. Michael Tkadletz (Chair of Functional Materials and Materials Systems, Montanuniversität Leoben, Austria)