3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device, and electronics markets, has extended its distribution network in the Southeast Asian market.

3D-Micromac AG is happy to announce Dymek Company Ltd. as a new trade agency in China and Southeast Asia.

Asia is a strategically important growth market for 3D-Micromac. Partnering with a highly experienced and well-established company like Dymek enables 3D-Micromac to strengthen its presence in the region. Thanks to Dymek’s deep expertise and strong customer relationships, this collaboration can not only accelerate 3D-Micromac’s business development in Asia but also create significant value for its customers. Together, Dymek and 3D-Micromac will be able to deliver advanced solutions and outstanding service that drive success for both companies.

Stanley Lam, Director of Global Business Development at Dymek, is looking forward to a mutually enriching collaboration: “3D-Micromac combines innovative technologies with a genuine focus on customer needs, innovating with its clients in mind and walking alongside them as they grow — qualities that resonate deeply in Asia. Together with Dymek, we will translate these strengths into lasting trust and long-term reliability for fabs, device makers, and production leaders across Asia.”

“The Asian market plays a vital role in the future growth of 3D-Micromac. By joining forces with DYMEK, a company with decades of proven expertise and strong industry connections, we are positioning ourselves to deliver future-driven technologies and first-class service to a broader customer base. This partnership marks an important step in accelerating innovation and creating long-term value for our clients and partners alike”, says Frank Richter, Head of Sales at 3D-Micromac AG.

Chemnitz, Germany, Nov. 13, 2025 — 3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device, and electronics markets, today introduced microPREP^® L—the latest addition to its microPREP family of laser-based sample preparation systems, which is designed to support sample sizes up to whole 12-inch (300-mm) wafers and system-level boards. This new platform enables fast, precise, reproducible, and non-destructive material removal at scale, delivering significant productivity gains for failure analysis, process development, and quality assurance in the semiconductor and electronics industries. Multiple samples can be prepared at different locations on the wafers or system-level boards within a single workflow, without process restarts.

The new microPREP L system will be featured at the upcoming International Symposium for Testing and Failure Analysis (ISTFA), taking place Nov. 16-20 in Pasadena, California. Attendees are invited to visit 3D-Micromac at Booth 318 to learn more and speak with company representatives about this breakthrough technology.

Overcoming Sample Preparation Bottlenecks

Sample preparation remains one of the most time-consuming and costly steps in semiconductor failure analysis. Traditional preparation methods like mechanical polishing and focused ion beam (FIB) milling cannot meet the stringent needs of today’s advanced applications. Mechanical polishing introduces mechanical stress to the specimen, which can affect the overall quality and yield. FIB milling is constrained by limited ablation rates, very small sample sizes, high tool operating costs, and the need for highly trained operators, making it impractical for large-scale or production-adjacent use.

Integrated sample prep systems that combine laser and FIB tools in a single platform introduce capacity bottlenecks, as only one function can operate at a time. These systems also suffer from particle contamination, which can compromise the integrity of the sample and downstream analysis.

microPREP L: A Dedicated, Scalable Alternative

Unlike hybrid platforms, the new microPREP L system is a dedicated, standalone laser micromachining solution that delivers precision, speed, and sample size scalability without compromise. Leveraging selective laser ablation and newly integrated real-time process monitoring, the system enables micrometer-level targeting and non-destructive removal of material—even from large and complex assemblies such as advanced semiconductor packages, printed circuit boards, and whole 12-inch wafers.

By supporting system-level preparation without cutting up the sample into smaller pieces, this platform helps preserve device integrity, accelerating failure localization and analysis. These capabilities also enable failure analysis to be extended beyond the lab and into fab environments, where rapid root-cause analysis is critical to improving yield and uptime.

In direct comparison with other sample preparation methods for failure analysis, the new microPREP L provides a multitude of advantages.

Key Features and Benefits

• Sample Scalability: Supports whole wafers up to 12 inches and large board-level devices—enabling failure analysis in both lab and fab environments—while offering a roadmap for even larger samples in future system extensions
• Selective Laser Ablation: Enables precise, localized material removal without destroying or damaging the regions of interest
• In-Situ Process Monitoring: Real-time depth sensing and ablation control ensures high accuracy—reducing rework and improving overall yield in failure analysis workflows
• Automated Workflows: Designed for high-throughput and repeatable operation with minimal operator intervention
• Multi-Sample Workflow Efficiency: Since the microPREP L can handle much larger sample sizes, customers can prepare multiple samples directly on the wafers or system-level boards in a single workflow without process restarts
• FIB/SEM Workflow Integration: Offloads bulk removal to the laser system, optimizing downstream tool use
• Customizable Recipes: Flexible for diverse materials and geometries

Significant Productivity Gains

In benchmark tests, a single operator using the microPREP L was able to prepare up to 32 samples per day, sufficient to feed up to seven plasma FIB systems—dramatically increasing throughput and reducing overall time-to-sample. In another case, a task that took just 23 minutes on the system would have taken up to six months using traditional gallium FIB milling.

“As semiconductor devices become more complex with the rise of heterogeneous integration, multi-layer architectures, and tighter development cycles, traditional sample preparation methods are no longer sufficient for advanced process development and failure analysis,” stated Uwe Wagner, CEO of 3D-Micromac AG. “Our new microPREP L system addresses these challenges head-on by enabling fast, precise, and damage-free sample prep at the wafer and system level. With its unmatched scalability and automated workflows, microPREP L is designed to meet the evolving needs of advanced semiconductor sample prep in both R&D and production environments.”

3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device, and electronics markets, has extended its distribution network into the Turkish market.

3D-Micromac AG announces Mems Enerji Sistemleri as new sales agency in Turkey. Mems Enerji Sistemleri has more than 50 years of market distribution experience for micro and nano fabrication companies. With experience especially in glass and semiconductor markets, Mems is the ideal partner to promote 3D-Micromac’s technologies in the region.

“We are convinced that our customers will appreciate the versatility, speed, and precision of 3D-Micromac AG’s laser micromachining solutions”, says Mehmet Türken, CEO of Mems Enerji Sistemleri.

Frank Richter, Head of Sales at 3D-Micromac AG, is looking forward to a close collaboration: “With Mems’ many years of experience and excellent market knowledge, we see great potential for opening up new customer groups in Turkey and further strengthening existing partnerships.”

About 3D-Micromac

Founded in 2002, 3D-Micromac AG is the industry leader in laser micromachining, delivering powerful, user-friendly and leading-edge processes with superior production efficiency. We develop processes, machines and turnkey solutions at the highest technical and technological level. 3D-Micromac systems and services have been successfully implemented in various high-tech industries worldwide including photovoltaic, semiconductor, glass and display industries, micro diagnostics, and medical technology. For more information, visit the company’s website at http://www.3d-micromac.com.

Contact:

3D-Micromac AG

Claudia Radelow
Team Leader Marketing and Public Relations 3D-Micromac AG
Phone: +49 371 40043-922
E-mail: radelow@3d-micromac.com

Meet 3D-Micromac at the M&M 2026!

The M&M 2025 is the annual conferences held by the Microscopy Association of America (MSA) and the Microanalysis Society (MAS). It features four full days of technical programming, a virtual exhibition, and networking events.

3D-Micromac will be part of the event in Milwaukee (Wisconsin), USA. Learn more about our laser-based sample preparation system, microPREP PRO.

We look forward to meeting you at M&M 2026!