Semiconductor Industry

Cost, quality and throughput are major factors in achieving successful manufacturing in the semiconductor industry. With the growing adoption of new types of wafer substrates, thinner wafers and scaling to smaller dimensions and larger-size substrates, wafer dicing is evolving as a critical value-add process step that not only ensures, but also further enhances, semiconductor device yields.

At the same time, traditional scaling of feature sizes in microelectronics is becoming increasingly cost prohibitive in order to add more functionality on devices within a smaller footprint. As a result, chip manufacturers are turning toward vertical stacking of devices and heterogenous integration schemes to enable smaller, higher-performance devices. This has created a greater need for methods of processing surface layers of the device without affecting buried structures, as well as selective exposure of functional areas on the device.

3D-Micromac addresses these critical needs with its microDICE™ laser micromachining system leveraging TLS-Dicing™ (thermal laser separation) for wafer dicing, and its microPRO™ RTP selective laser annealing system.

Laser Dicing with microDICE™

TLS-Dicing™ System for Separation of Silicon and Silicon Carbide Wafers

The microDICE™ laser micromachining system leverages TLS-Dicing™ – a unique technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs), into dies with outstanding edge quality while increasing manufacturing yield and throughput. Compared to traditional separation technologies, such as saw dicing and laser ablation, TLS-Dicing enables a clean process, micro-crack-free edges, and higher resulting bending strength.

Capable of dicing speeds up to 300mm per second, the microDICE system provides up to a 10X increase in process throughput compared to traditional dicing systems. Its high throughput, outstanding edge quality and 300-mm wafer capable platform enables a true high-volume production process, especially for SiC-based devices.

In addition, microDICE reduces the dicing cost per wafer by up to an order of magnitude or more compared to other wafer dicing approaches. Due to the contactless laser machining method, there is no tool wear and no expensive consumables are required. This results in up to 15X lower cost of ownership over the entire life-time of the dicing system.

More information is available at https://3d-micromac.com/laser-micromachining/products/microdice/.

Laser Annealing with microPRO™ RTP

Selective Laser Annealing System for Semiconductor Applications

Combining a state-of-the-art laser optic module with 3D-Micromac’s highly modular semiconductor wafer dicing platform, the microPRO RTP provides selective annealing with high repeatability and high throughput. The system features a line scan option for vertical selective annealing and a step-and-repeat spot option for horizontal selective annealing, as well as three optional wavelength lasers (near infrared, green and ultraviolet), resulting in a highly flexible, high-quality laser annealing platform.

The microPRO RTP can address a wide variety of existing and emerging applications, including:

  • Ohmic contact formation in silicon carbide (SiC) power devices to improve resistance
  • Dopant activation for insulated gate bipolar transistors (IGBT) and backside illuminated (BSI) CMOS image sensors
  • The manufacture of certain types of MEMS devices such as semiconductor magnetic field sensors.