microPREP™ PRO

Laser-Based Sample Preparation for Microstructure Diagnostics

The microPREP™ PRO system was developed to provide efficient laser sample preparation fitted to the needs of microstructure diagnostics and failure diagnostics. Therefore, with microPREP™ PRO material samples can be prepared effectively and economically by using an ultra-short pulse laser.

microPREP™ PRO allows to create complex and 3D-shaped samples to enable more comprehensive analysis of certain structures like in advanced packages, such as through silicon vias (TSVs), or even complete systems-in-package (SiP).

Furthermore, it is ideal to provide larger-sized samples with micron-level precision. The integrated overview camera assists in navigating on larger samples – the high-definition process camera allows for exact positioning.

Moreover, the application of a pico-second laser ensures virtually no structural damage and no elemental contamination of the material. In addition, microPREP™ PRO’s novel approach features substantially higher ablation rates in comparison to purely ion-beam-based processes.

The modular software design of microPREP™ ensures high flexibility for machining of samples for a broad range of microstructure diagnostics techniques. Based on machine-provided and customer-designed parameter-setups (recipes) microPREP™ PRO provides the best technology for sample preparation for:

  • Scanning Electron Microscopy (SEM),
  • Transmission Electron Microscopy (TEM),
  • X-ray Microscopy (XRM),
  • Atom-Probe Tomography (APT), and
  • Micromechanics.

Through ongoing development more and more areas of application are appearing on the market, in which microPREP™ PRO is able to assist in processing sample preparation for material analysis. Apart from mere preparation, samples can also be marked for easy tracking by microPREP™ PRO.

Contact

Please contact our technical sales team for more information.

Boris Rottwinkel
Tel: +49 371 40043-222
sales@3d-micromac.com

Scientific Publications

2018

TEM sample preparation workflow using laser ablation and broad ion beam milling.
2018, Poster, IMC19 – (Takanori Sato, Jacob Byrnes), Australian Centre for Microscopy & Microanalysis, The University of Sydney.

A combined laser ablation/focused ion beam approach to atom probe sample preparation.
2018, Poster, IMC19 – (Jacob Byrnes, Ingrid McCarroll, Katja Eder, Limei Yang, Julie Cairney), The University of Sydney.

Laser preparation of semiconductor devices for failure analysis.
2018, 11. Jenaer Lasertagung (3D-Micromac, Infineon, Thales, FhG-IMWS-CAM).

Laser-Micromachining for Failure Analysis: from TEM Sample Preparation to Large Area SEM Inspection.
2018, 7th CAM Workshop (3D-Micromac, Infineon, Bosch, FhG IMWS-CAM).

Rapid and localized ion-beam etching of surfaces using initial notches
2018,  Micron – (Busch, R.; Krause, M.; Coyle, S.; Höche, T.).

An Evaluation of Beam-Damage Zone in Si Wafer Machined by Gatan MicroPREPTM Laser-Ablation
2018, Microscopy and Microanalysis – (Zhao, W.; Bennett, C.; Sairam Pichumani, R.; Walker, G.; Eaton, K.; Hassel Shearer, M.; Dumas, L.; Brooks, I.; Wang, Y.).

A New, Efficient Method for Preparation of 3D Integrated Systems by Laser Techniques
2018, IEEE 68th ECTC – (Klengel, R.; Klengel, S.; Schusser, G.; Krause, M.).

Nanoscale 3D X-ray Microscopy for High Density Multi-Chip Packaging FA
2018, ISTFA – (Schmidt, C.).

2017

Combination of precise laser and FIB milling for TEM based IC failure analysis
2017, ESREF – (F. Altmann, M. Simon-Najasek, S. Hübner, M. Lejoyeux).

Pico-Second Laser and Broad Argon Beam Tools for Characterization of Advanced Packages and Devices
2017, ISTFA – (Hassel Shearer, M.).

Pico-Second Laser and Broad Argon Beam Tools For Characterization Of Advanced Packages And Devices
2017, EFUG Workshop – (Richard, V.;Hassel Shearer, M.).

Novel sample preparation and High-Resolution X-ray tomography for Package FA
2017, IPFA – (Schmidt, C.; Kelly, S. T. ; Ying Wang ; S. T. Coyle ; Michael Hassel Shearer).

2016

Laser based sample preparation for advanced packaging application
2016, EFUG – (Höche, T.; Krause, M.).

microPREP: A new laser tool for high-volume sample preparation
2016, IPFA Manuscript – (Wagner, U.; Petsch, T.; Krause, M.; Höche, T.).

2015

A Novel Laser Tool for High-Volume Sample Preparation
2015, Laser-Technik-Journal (Thomas Höche , Michael Krause , Martin Ebert , Uwe Wagner , Mandy Gebhardt).

New Approach of Laser Processing of Transparent Materials
2015, Lasers in Manufacturing Conference – (Werner, M.; Zimny, R.; Grimm, M.).

2014

microPREP – a new laser tool for high-throughput sample preparation
2014, 40th ISTFA (Krause, M.; Ebert, M.; Höche, T.; Wagner, U.).

Highlights

  • Free-form or box milling and line cut for quick access to the area of interest
  • Loading any kind of geometry into the system
  • Preparing cylindrical samples for XRM and synchrotron applications with the rotation tool
  • Multiple samples in one run enable more throughput
  • Motorized stages to find the area of interest as fast as possible
  • Recipe-driven Software for fast and easy sample preparation
  • Navigating with the overview camera to the area of interest
  • Cleaning samples during or after the process to have samples ready for the next step
  • Upgradeable for coming options

By using ultra-short pulse laser microPREP™ PRO is  best suited for sample preparation. Key benefits of micromachining with ultrashort pulsed lasers are particularly low structural damage, high power densities, and targeted precision on the micron scale. Thus, microPREP™ PRO is up for laser cutting and local laser thinning in metals, semiconductors, ceramics, as well as compounds and polymers.

microPREP™ PRO enables high-volume sample preparation for microstructure diagnostics and failure analysis.  Furthermore, the integrated COSnow Jet and the additional overview camera helps you to reduce your time to sample even more.

Suited for

  • Laser cutting and individual sample preparation
  • SEM- and micro-analysis
  • Sample preparation for micro mechanics (dog-bones or other geometries)
  • In-plane and cross section for TEM (based on microPREP XL-Chunk stage)
  • X-Ray Microscopy
  • Pre-shaped APT samples