High-Throughput Laser Based Microdiagnostics Sample Preparation

The all-new microPREP™ is the first instrument to enable fast, clean, and efficient laser ablation available for the preparation of samples for microstructure diagnostics and failure analysis.

microPREP™ provides key benefits of micromachining using ultrashort pulsed lasers, particularly low structural damage, high power densities and targeted precision on the micron scale.

Thus microPREP™ is up for laser cutting and local laser thinning in semiconductors, metals, ceramics, as well as compounds.

Highlights of microPREP™

  • Shorter time to sample: up to 10 000 times faster than FIB
  • Analysis-adopted sample geometry
  • Minimized risk of sample loss
  • Recipe-driven GUI for sample geometries and materials
  • Reduced FIB capacity requirements
  • Enhanced efficiency of existing (TEM) analysis tools
  • Custom recipes and fixtures on request
  • Meets the essential requirements of the SEMI S2 / S8

microPREP™ is suited for

  • Fast sample preparation of metals and semiconductors, ceramics and compound materials
  • High accuracy target preparation of ± 0.003 mm
  • Marking for sample track and trace (DMC, QR code, plain text, etc.)
  • Increasing the workflow throughput of FIB and broad ion beam tools
  • TEM, X-SEM, XRM, APT, and micromechanical testing

Please contact us for more information!

Jan Klinger
Head of Sales and Product Management

+49 (0)371 40043-66 / -228

Das Team Sales & Product Management