Laser-Based Sample Preparation for Microstructure Diagnostics

The all-new microPREP™ system was developed to provide efficient laser sample preparation fitted to the needs of microstructure diagnostics and failure diagnostics.

The modular software design of microPREP™ ensures high flexibility for machining of samples for a broad range of microstructure diagnostics techniques. Besides the provision of recipes and the capability to mark samples for easy tracking, this novel approach features three orders of magnitude higher ablation rates in comparison to purely ion-beam-based processes.

microPREP™ is suitable for transmission electron microscopy, X-ray microscopy (XRM), atom-probe tomography, transmission Kikuchi diffraction, and micromechanical testing. In addition to the microPREP™ platform for small-scale and R&D applications, 3D-Micromac offers the microPREP™ PRO platform for high-volume sample preparation applications, which includes the ability to create complex and 3D-shaped samples to enable more comprehensive analysis of certain structures in advanced packages, such as through silicon vias (TSVs), or even complete systems-in-package (SiP).


Please contact our technical sales team for more information.

Boris Rottwinkel
Tel: +49 371 40043-222

Scientific Publications


TEM sample preparation workflow using laser ablation and broad ion beam milling.
2018, Poster, IMC19 – (Takanori Sato, Jacob Byrnes), Australian Centre for Microscopy & Microanalysis, The University of Sydney.

A combined laser ablation/focused ion beam approach to atom probe sample preparation.
2018, Poster, IMC19 – (Jacob Byrnes, Ingrid McCarroll, Katja Eder, Limei Yang, Julie Cairney), The University of Sydney.

Rapid and localized ion-beam etching of surfaces using initial notches
2018,  Micron – (Busch, R.; Krause, M.; Coyle, S.; Höche, T.).

An Evaluation of Beam-Damage Zone in Si Wafer Machined by Gatan MicroPREPTM Laser-Ablation
2018, Microscopy and Microanalysis – (Zhao, W.; Bennett, C.; Sairam Pichumani, R.; Walker, G.; Eaton, K.; Hassel Shearer, M.; Dumas, L.; Brooks, I.; Wang, Y.).

A New, Efficient Method for Preparation of 3D Integrated Systems by Laser Techniques
2018, IEEE 68th ECTC – (Klengel, R.; Klengel, S.; Schusser, G.; Krause, M.).

Nanoscale 3D X-ray Microscopy for High Density Multi-Chip Packaging FA
2018, ISTFA – (Schmidt, C.).


Combination of precise laser and FIB milling for TEM based IC failure analysis
2017, ESREF – (F. Altmann, M. Simon-Najasek, S. Hübner, M. Lejoyeux).

Pico-Second Laser and Broad Argon Beam Tools for Characterization of Advanced Packages and Devices
2017, ISTFA – (Hassel Shearer, M.).

Pico-Second Laser and Broad Argon Beam Tools For Characterization Of Advanced Packages And Devices
2017, EFUG Workshop – (Richard, V.;Hassel Shearer, M.).

Novel sample preparation and High-Resolution X-ray tomography for Package FA
2017, IPFA – (Schmidt, C.; Kelly, S. T. ; Ying Wang ; S. T. Coyle ; Michael Hassel Shearer).


Laser based sample preparation for advanced packaging application
2016, EFUG – (Höche, T.; Krause, M.).

microPREP: A new laser tool for high-volume sample preparation
2016, IPFA Manuscript – (Wagner, U.; Petsch, T.; Krause, M.; Höche, T.).


A Novel Laser Tool for High-Volume Sample Preparation
2015, Laser-Technik-Journal (Thomas Höche , Michael Krause , Martin Ebert , Uwe Wagner , Mandy Gebhardt).

New Approach of Laser Processing of Transparent Materials
2015, Lasers in Manufacturing Conference – (Werner, M.; Zimny, R.; Grimm, M.).


microPREP – a new laser tool for high-throughput sample preparation
2014, 40th ISTFA (Krause, M.; Ebert, M.; Höche, T.; Wagner, U.).