Laser Micromachining Systems for Processing of Large Substrates

The microSHAPE™ laser system is a modular platform designed for high accurate and high dynamic processing of large and flat substrates. The highly versatile system allows to combine different laser processes as well as the processing with multiple working heads. The availability of several handling and inspection options enables the system to be a highly efficient production platform.

microSHAPE™ is an industry-proven solution for all kind of ablative and non ablative cutting or structuring processes. This includes filamentation, thermal laser separation, half cut or full cut, and engraving processes. The microSHAPE™ is suitable for machining a variety of substrates, e.g. glass, metals, polymer, ceramics, display stacks and coated substrates.


Please contact our technical sales team for more information.

Frank Richter