Chemnitz, Germany, Nov. 13, 2025 — 3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device, and electronics markets, today introduced microPREP^® L—the latest addition to its microPREP family of laser-based sample preparation systems, which is designed to support sample sizes up to whole 12-inch (300-mm) wafers and system-level boards. This new platform enables fast, precise, reproducible, and non-destructive material removal at scale, delivering significant productivity gains for failure analysis, process development, and quality assurance in the semiconductor and electronics industries. Multiple samples can be prepared at different locations on the wafers or system-level boards within a single workflow, without process restarts.

The new microPREP L system will be featured at the upcoming International Symposium for Testing and Failure Analysis (ISTFA), taking place Nov. 16-20 in Pasadena, California. Attendees are invited to visit 3D-Micromac at Booth 318 to learn more and speak with company representatives about this breakthrough technology.

Overcoming Sample Preparation Bottlenecks

Sample preparation remains one of the most time-consuming and costly steps in semiconductor failure analysis. Traditional preparation methods like mechanical polishing and focused ion beam (FIB) milling cannot meet the stringent needs of today’s advanced applications. Mechanical polishing introduces mechanical stress to the specimen, which can affect the overall quality and yield. FIB milling is constrained by limited ablation rates, very small sample sizes, high tool operating costs, and the need for highly trained operators, making it impractical for large-scale or production-adjacent use.

Integrated sample prep systems that combine laser and FIB tools in a single platform introduce capacity bottlenecks, as only one function can operate at a time. These systems also suffer from particle contamination, which can compromise the integrity of the sample and downstream analysis.

microPREP L: A Dedicated, Scalable Alternative

Unlike hybrid platforms, the new microPREP L system is a dedicated, standalone laser micromachining solution that delivers precision, speed, and sample size scalability without compromise. Leveraging selective laser ablation and newly integrated real-time process monitoring, the system enables micrometer-level targeting and non-destructive removal of material—even from large and complex assemblies such as advanced semiconductor packages, printed circuit boards, and whole 12-inch wafers.

By supporting system-level preparation without cutting up the sample into smaller pieces, this platform helps preserve device integrity, accelerating failure localization and analysis. These capabilities also enable failure analysis to be extended beyond the lab and into fab environments, where rapid root-cause analysis is critical to improving yield and uptime.

In direct comparison with other sample preparation methods for failure analysis, the new microPREP L provides a multitude of advantages.

Key Features and Benefits

• Sample Scalability: Supports whole wafers up to 12 inches and large board-level devices—enabling failure analysis in both lab and fab environments—while offering a roadmap for even larger samples in future system extensions
• Selective Laser Ablation: Enables precise, localized material removal without destroying or damaging the regions of interest
• In-Situ Process Monitoring: Real-time depth sensing and ablation control ensures high accuracy—reducing rework and improving overall yield in failure analysis workflows
• Automated Workflows: Designed for high-throughput and repeatable operation with minimal operator intervention
• Multi-Sample Workflow Efficiency: Since the microPREP L can handle much larger sample sizes, customers can prepare multiple samples directly on the wafers or system-level boards in a single workflow without process restarts
• FIB/SEM Workflow Integration: Offloads bulk removal to the laser system, optimizing downstream tool use
• Customizable Recipes: Flexible for diverse materials and geometries

Significant Productivity Gains

In benchmark tests, a single operator using the microPREP L was able to prepare up to 32 samples per day, sufficient to feed up to seven plasma FIB systems—dramatically increasing throughput and reducing overall time-to-sample. In another case, a task that took just 23 minutes on the system would have taken up to six months using traditional gallium FIB milling.

“As semiconductor devices become more complex with the rise of heterogeneous integration, multi-layer architectures, and tighter development cycles, traditional sample preparation methods are no longer sufficient for advanced process development and failure analysis,” stated Uwe Wagner, CEO of 3D-Micromac AG. “Our new microPREP L system addresses these challenges head-on by enabling fast, precise, and damage-free sample prep at the wafer and system level. With its unmatched scalability and automated workflows, microPREP L is designed to meet the evolving needs of advanced semiconductor sample prep in both R&D and production environments.”

Our laser micromachining system microPREP PRO is constantly evolving. As our customers and users of the microPREP PRO are constantly giving us feedback on what they need to make their sample preparation tasks even easier, we are always developing new workflows, recipes and accessories. This free webinar will give you an overview on the latest updates for the microPREP PRO system and will explain how these updates can facilitate your lab work.

Amongst others the following topics will be covered:

• New Ramp Workflow: Learn how to save precious lab time by milling ramps instead of boxes into the sample and thus remove less material!
• Improved Scan Regimes: What does this mean for your samples and their surface quality?
• Image Overlay: Find out how to navigate on your specimen as easy as on any construction plan!

This webinar is suited for you if:

• you already have an idea of what a microPREP PRO is used for OR
• you are using a microPREP PRO system already in your lab OR
• you are wondering if microPREP could help you with your sample preparation tasks

You can now watch this webinar online.

Is laser micromachining the solution for everything? Can any laser source machine any material? Which accuracies can be achieved with a laser micromachining tool such as the microPREP PRO? And what do you need to watch out for in order to achieve best results?

This free webinar will bust some of the most common laser micromachining myths and give you hands-on advices on how-to handle. Amongst others the following topics will be covered:

• Which materials and material combinations can be processed by laser?
• How can contamination be prevented while working with lasers?
• Which laser sources are available? And which laser source is suited for what?
• What kind of micromachining is possible with the microPREP PRO? What are the limits?
• How accurate can you work while using lasers?

You can now watch the recording of this webinar online.