The formation of ohmic contacts on the backside of SiC power devices plays a key role in defining their electrical characteristics and mechanical strength. Traditionally, thermal annealing has been used for ohmic contact formation, but the extremely high temperatures associated with this process can damage structures on the front side of wafers.
We would like to invite you to our free webinar ”Selective Laser Annealing for Ohmic Contact Formation (OCF)” on December 8th, 2020, 5:00 pm to 5:45 pm CET.
This webinar will cover the following topics:
• Thermal annealing vs. selective laser annealing
• Advantages for thin wafers
• 3D-Micromac’s Solution – microPRO™ XS for OCF
At the end of the webinar we will discuss all upcoming questions.
Of course, the webinar will be recorded and can be watched later on, too.