Chemnitz, Germany, Sep. 29, 2026 — 3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device, and electronics markets, today announced that it will highlight its microPREP® L laser-based sample preparation system at SEMICON West, the premier microelectronics exhibition in North America, October 13-15, in San Francisco, Calif. Designed for advanced semiconductor failure analysis and quality assurance, microPREP® L supports sample sizes ranging from individual dies up to whole 12-inch (300-mm) wafers and system-level boards.

3D-Micromac will discuss microPREP® L’s capabilities during the Test Vision Poster Session on Wednesday, October 14 from 3:10-5:00pm in its presentation “Large-Format Laser Processing for Targeted Defect Access and Removal Following System-Level Testing.” The presentation will address how targeted laser access and defect removal meet emerging requirements in system-level failure analysis, including board-level preparation, wafer-level processing, multi-site workflows, reduced mechanical sample handling, and faster response to quality issues.

New Sample Preparation Requirements for Advanced Packaging

Driven by AI and other high-performance computing applications, semiconductor devices and systems are becoming increasingly complex as heterogeneous integration and advanced packaging bring more functionality into tightly integrated designs. At the same time, advanced packages and system-level boards are becoming larger and thicker, while the individual layers and structures within them are becoming thinner and more difficult to access selectively. This combination of increasing scale and complexity creates new challenges for conventional sample preparation methods. Mechanical techniques can affect specimen integrity, while focused ion beam (FIB) and broad ion beam (BIB) milling require significant time for coarse, large-volume material removal.

microPREP® L addresses these challenges with a dedicated laser-based sample preparation platform that bridges the gap between high-speed, large-volume material removal and precise, selective processing. Its large-format capability enables engineers to process regions of interest directly on full wafers and system-level boards without first cutting them into smaller pieces. Depending on the application, laser processing can provide sufficient access for inspection or serve as a high-speed front-end step, offloading material removal from costly analytical tools such as ion beam systems so they can focus on final polishing, imaging, and high-resolution analysis.

“The growing complexity of advanced semiconductor devices and systems is changing what failure analysis and quality assurance teams need from sample preparation,” stated Uwe Wagner, CEO of 3D-Micromac AG. “The range of applications we are seeing for microPREP® L shows that sample preparation increasingly needs to accommodate the scale and complexity of the device, package, and system, rather than forcing it to fit the limitations of the preparation tool. We collaborate closely with customers to understand their specific failure analysis requirements and help them develop and optimize the right preparation approach for their application. That combination of flexibility and expertise helps customers accelerate sample preparation and make more effective use of their downstream analytical resources.”

microPREP® L further increases productivity through recipe-driven automation that enables multiple preparation tasks to run sequentially and unattended at different locations across the same wafer or board. Real-time in-situ depth sensing monitors material removal during processing, reducing iterative process-measure-reprocess cycles and helping speed time-to-sample. Integrated 3D imaging and measurement enables topographic mapping between processing steps, allowing users to precisely target areas for laser processing, verify resulting dimensions and geometries, and continue processing based on the measurement data. An optional sealed process chamber also supports processing under vacuum or an inert atmosphere for applications requiring controlled environmental conditions. Additional options include cryogenic processing for temperature-sensitive materials and chemically assisted laser processing aimed at improving surface quality and process efficiency.

Meet 3D-Micromac at SEMICON West 2026

To speak with a 3D-Micromac representative and learn more about the company’s laser solutions for failure analysis and sample preparation, as well as other semiconductor applications, visit 3D-Micromac’s booth 1245 (South Hall, Germany Pavilion) during exhibition hours.

For members of the media interested in learning more about 3D-Micromac’s microPREP® L solution, please contact David Moreno, Open Sky Communications, at dmoreno@openskypr.com.

Left: selective defect removal on a wafer. Right: selective defect removal on a board. Both applications enabled by microPREP®L.
Copyright: 3D-Micromac AG.

Meet 3D-Micromac at SEMICON West 2026

To speak with a 3D-Micromac representative and learn more about the company’s laser solutions for failure analysis and sample preparation, as well as other semiconductor applications, visit 3D-Micromac’s booth 1245 (South Hall, Germany Pavilion) during exhibition hours.

For members of the media interested in learning more about 3D-Micromac’s microPREP® L solution, please contact David Moreno, Open Sky Communications, at dmoreno@openskypr.com.

Chemnitz, Germany, Nov. 13, 2025 — 3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device, and electronics markets, today introduced microPREP^® L—the latest addition to its microPREP family of laser-based sample preparation systems, which is designed to support sample sizes up to whole 12-inch (300-mm) wafers and system-level boards. This new platform enables fast, precise, reproducible, and non-destructive material removal at scale, delivering significant productivity gains for failure analysis, process development, and quality assurance in the semiconductor and electronics industries. Multiple samples can be prepared at different locations on the wafers or system-level boards within a single workflow, without process restarts.

The new microPREP L system will be featured at the upcoming International Symposium for Testing and Failure Analysis (ISTFA), taking place Nov. 16-20 in Pasadena, California. Attendees are invited to visit 3D-Micromac at Booth 318 to learn more and speak with company representatives about this breakthrough technology.

Overcoming Sample Preparation Bottlenecks

Sample preparation remains one of the most time-consuming and costly steps in semiconductor failure analysis. Traditional preparation methods like mechanical polishing and focused ion beam (FIB) milling cannot meet the stringent needs of today’s advanced applications. Mechanical polishing introduces mechanical stress to the specimen, which can affect the overall quality and yield. FIB milling is constrained by limited ablation rates, very small sample sizes, high tool operating costs, and the need for highly trained operators, making it impractical for large-scale or production-adjacent use.

Integrated sample prep systems that combine laser and FIB tools in a single platform introduce capacity bottlenecks, as only one function can operate at a time. These systems also suffer from particle contamination, which can compromise the integrity of the sample and downstream analysis.

microPREP L: A Dedicated, Scalable Alternative

Unlike hybrid platforms, the new microPREP L system is a dedicated, standalone laser micromachining solution that delivers precision, speed, and sample size scalability without compromise. Leveraging selective laser ablation and newly integrated real-time process monitoring, the system enables micrometer-level targeting and non-destructive removal of material—even from large and complex assemblies such as advanced semiconductor packages, printed circuit boards, and whole 12-inch wafers.

By supporting system-level preparation without cutting up the sample into smaller pieces, this platform helps preserve device integrity, accelerating failure localization and analysis. These capabilities also enable failure analysis to be extended beyond the lab and into fab environments, where rapid root-cause analysis is critical to improving yield and uptime.

In direct comparison with other sample preparation methods for failure analysis, the new microPREP L provides a multitude of advantages.

Key Features and Benefits

• Sample Scalability: Supports whole wafers up to 12 inches and large board-level devices—enabling failure analysis in both lab and fab environments—while offering a roadmap for even larger samples in future system extensions
• Selective Laser Ablation: Enables precise, localized material removal without destroying or damaging the regions of interest
• In-Situ Process Monitoring: Real-time depth sensing and ablation control ensures high accuracy—reducing rework and improving overall yield in failure analysis workflows
• Automated Workflows: Designed for high-throughput and repeatable operation with minimal operator intervention
• Multi-Sample Workflow Efficiency: Since the microPREP L can handle much larger sample sizes, customers can prepare multiple samples directly on the wafers or system-level boards in a single workflow without process restarts
• FIB/SEM Workflow Integration: Offloads bulk removal to the laser system, optimizing downstream tool use
• Customizable Recipes: Flexible for diverse materials and geometries

Significant Productivity Gains

In benchmark tests, a single operator using the microPREP L was able to prepare up to 32 samples per day, sufficient to feed up to seven plasma FIB systems—dramatically increasing throughput and reducing overall time-to-sample. In another case, a task that took just 23 minutes on the system would have taken up to six months using traditional gallium FIB milling.

“As semiconductor devices become more complex with the rise of heterogeneous integration, multi-layer architectures, and tighter development cycles, traditional sample preparation methods are no longer sufficient for advanced process development and failure analysis,” stated Uwe Wagner, CEO of 3D-Micromac AG. “Our new microPREP L system addresses these challenges head-on by enabling fast, precise, and damage-free sample prep at the wafer and system level. With its unmatched scalability and automated workflows, microPREP L is designed to meet the evolving needs of advanced semiconductor sample prep in both R&D and production environments.”

3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device and electronics markets, today announced the order intake for a microVEGA® xMR selective laser annealing system from Multidimension Technology Co., Ltd.  Multidimension Technology (MTD) is one of the leading manufacturer of innovative high-performance, low-cost TMR magnetic sensors based in Zhangjiagang (Jiangsu Province, China), with branch offices in Ningbo, Shanghai, Chengdu and San Jose (Califonia, USA) will be using the microVEGA xMR for the production of TMR magnet sensors.

The microVEGA xMR selective laser annealing system provides several advantages over thermal annealing, that is traditionally used for magnetic sensor manufacturing. These advantages include higher precision that enable the processing of smaller magnetic device structures. This results in more devices per wafer, as well as the ability to set different reference magnetization directions on sensors across a single wafer. In addition, the microVEGA’s on-the-fly spot and variable laser energy provide the possibility of selective heating of the pinning layer in each sensor to “imprint” the intended magnetic orientation. Also, magnetic field strength and orientation is adjustable by recipe. High-temperature gradients ensurea low thermal impact on the sensors. Therefore, sensors can be processed directly next to read-out electronics as well as closer together. Such being the case, the production of smaller sensors becomes possible — which allows to process more devices per wafer with microVEGA xMR. Reduced process steps, simplified production flow, higher yield, and more cost-effective production of integrated monolithic sensor packages are the results.

More information on the microVEGA xMR selective laser annealing system is also available on https://3d-micromac.com/laser-micromachining/laser-micromachining-systems/microvega-xmr/ and in the whitepaper “Monolithic Magnetic Sensors Manufactured by Selective Laser Annealing” that is available on lasersensorformation.com.

Chemnitz, Germany, July 28, 2024— 3D-Micromac AG, the leading provider of laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaics, glass, and display industries, announced that Infineon Technologies Dresden GmbH & Co. KG has ordered one of 3D-Micromac’s first microVEGA® FC laser-trimming-systems for Infineon’s new Smart Power Fab in Dresden, Germany. Designed specifically for Infineon, 3D-Micromac is the exclusive supplier of the microVEGA FC laser-trimming system to Infineon Dresden, who is utilizing this advanced technology for its semiconductor laser-trimming applications for the new Smart Power Fab.

The order was preceded by a joint development project in which 3D-Micromac’s laser-trimming process was transferred into a mass-production-capable laser system. The basis for the new solution was the microVEGA system – a system that has already been utilized successfully to process up to 12-inch semiconductor wafers in several industrial use cases.

The laser beam of the microVEGA FC is shaped in the single-digit micrometer range and moves continuously over semiconductor chips. During this motion, the laser selectively processes defined microstructures of several dies. This trimming process adjusts the resistance value in individual IC chips to a target value. The small size of the dies’ structures (approximately 1-2 µm) and the resulting extremely high demands on the three-dimensional positioning accuracy of the laser spot in relation to the structures place the highest demands on the machine hardware. The microVEGA FC includes an integrated measuring technology to achieve 100 percent process control, overcoming a particular challenge in semiconductor lase-trimming applications. The microVEGA FC system, developed by 3D-Micromac, features fully automatic handling for 8- and 12-inch wafers. At process speeds of up to 400 mm/s, the system achieves a positioning accuracy of ±200 nm (at Sigma 3).

Infineon plans to begin manufacturing analog/mixed-signal technologies and power semiconductors in Dresden’s Smart Power Fab in the fall of 2026. The interaction of power semiconductors and analog/mixed-signal components enables particularly energy-efficient and intelligent system solutions commonly used in power supply systems, such as energy-efficient chargers, smaller engine control units for cars, data centers, and Internet of Things (IoT) applications.

Infineon has decided to work with 3D-Micromac to adopt advanced European production technology. Raik Brettschneider, managing director of Infineon Dresden, states, “3D-Micromac’s experience and innovative strength, as well as the close exchange between the specialists of both companies, led to the joint development project’s success. Together, we have paved the way for the microVEGA FC and its future use in Infineon’s production chain. We are content that we can now order the first 3D-Micromac system.” Both companies share a goal of installing 3D-Micromac AG’s laser-trimming-systems at more of Infineon’s production sites. “We are pleased that Infineon decided to go with 3D-Micromac as their supplier for laser-trimming technologies,” Uwe Wagner, CEO of 3D-Micromac AG, concludes. “We are proud to support the European Commission’s goal of increasing the European share of semiconductor production and helping to secure value chains in key European countries.”

Our laser micromachining system microPREP PRO is constantly evolving. With the feedback of microPREP PRO users, we are always working on new workflows, recipes, and accessories. In our free microPREP PRO update webinar, we give you an overview of the latest updates for the microPREP PRO system. And, of course, we explain how these updates can facilitate your lab work. The main focus of the November 2022 edition is:

Custom Shape 2.0:

Learn how to put together your own custom shapes for the preparation of your samples

✔ directly in the microPREP PRO software

❌ without the need for a CAD program Improved Box

Improved Box Milling Workflow:

💡 Now you can change your preparation geometry live during processing.

🔎 Giving you the freedom to react to what you discover while preparing your specimen.

This microPREP™ PRO update webinar is suited for you if:

• you already have an idea of what a microPREP PRO is used for OR
• you are using a microPREP PRO system already in your lab OR
• you are wondering if microPREP could help you with your sample preparation tasks

You can now watch this webinar online.

We celebrate our 20th company anniversary on March 14, 2022! 3D-Micromac AG was founded in 2002 with only six employees and a vision of the enormous potential of laser micromachining. Today, about 200 employees work for us at our Chemnitz site.

3D-Micromac has established itself as a leading international supplier of laser systems for micromachining and as a pioneer of new production technologies for a wide range of industries. Our laser machines are developed and manufactured at our Chemnitz site. They are mainly used in rapidly growing high-tech markets such as the semiconductor industry, display manufacturing, and medical technology. There are now more than 600 3D-Micromac laser systems in industrial use worldwide.

“We owe the growth and success of our company to our customers and partners, who have trusted in our competence and performance from the very beginning,” explains Uwe Wagner, CEO of 3D-Micromac AG. “However, without the outstanding commitment and top performance of all employees, such a successful development would not have been possible. Therefore, we are happy to be able to celebrate our anniversary together with our team.”