3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device, and electronics markets, has extended its distribution network in the Southeast Asian market.

3D-Micromac AG is happy to announce Dymek Company Ltd. as a new trade agency in China and Southeast Asia.

Asia is a strategically important growth market for 3D-Micromac. Partnering with a highly experienced and well-established company like Dymek enables 3D-Micromac to strengthen its presence in the region. Thanks to Dymek’s deep expertise and strong customer relationships, this collaboration can not only accelerate 3D-Micromac’s business development in Asia but also create significant value for its customers. Together, Dymek and 3D-Micromac will be able to deliver advanced solutions and outstanding service that drive success for both companies.

Stanley Lam, Director of Global Business Development at Dymek, is looking forward to a mutually enriching collaboration: “3D-Micromac combines innovative technologies with a genuine focus on customer needs, innovating with its clients in mind and walking alongside them as they grow — qualities that resonate deeply in Asia. Together with Dymek, we will translate these strengths into lasting trust and long-term reliability for fabs, device makers, and production leaders across Asia.”

“The Asian market plays a vital role in the future growth of 3D-Micromac. By joining forces with DYMEK, a company with decades of proven expertise and strong industry connections, we are positioning ourselves to deliver future-driven technologies and first-class service to a broader customer base. This partnership marks an important step in accelerating innovation and creating long-term value for our clients and partners alike”, says Frank Richter, Head of Sales at 3D-Micromac AG.

Chemnitz, Germany, Nov. 13, 2025 — 3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device, and electronics markets, today introduced microPREP^® L—the latest addition to its microPREP family of laser-based sample preparation systems, which is designed to support sample sizes up to whole 12-inch (300-mm) wafers and system-level boards. This new platform enables fast, precise, reproducible, and non-destructive material removal at scale, delivering significant productivity gains for failure analysis, process development, and quality assurance in the semiconductor and electronics industries. Multiple samples can be prepared at different locations on the wafers or system-level boards within a single workflow, without process restarts.

The new microPREP L system will be featured at the upcoming International Symposium for Testing and Failure Analysis (ISTFA), taking place Nov. 16-20 in Pasadena, California. Attendees are invited to visit 3D-Micromac at Booth 318 to learn more and speak with company representatives about this breakthrough technology.

Overcoming Sample Preparation Bottlenecks

Sample preparation remains one of the most time-consuming and costly steps in semiconductor failure analysis. Traditional preparation methods like mechanical polishing and focused ion beam (FIB) milling cannot meet the stringent needs of today’s advanced applications. Mechanical polishing introduces mechanical stress to the specimen, which can affect the overall quality and yield. FIB milling is constrained by limited ablation rates, very small sample sizes, high tool operating costs, and the need for highly trained operators, making it impractical for large-scale or production-adjacent use.

Integrated sample prep systems that combine laser and FIB tools in a single platform introduce capacity bottlenecks, as only one function can operate at a time. These systems also suffer from particle contamination, which can compromise the integrity of the sample and downstream analysis.

microPREP L: A Dedicated, Scalable Alternative

Unlike hybrid platforms, the new microPREP L system is a dedicated, standalone laser micromachining solution that delivers precision, speed, and sample size scalability without compromise. Leveraging selective laser ablation and newly integrated real-time process monitoring, the system enables micrometer-level targeting and non-destructive removal of material—even from large and complex assemblies such as advanced semiconductor packages, printed circuit boards, and whole 12-inch wafers.

By supporting system-level preparation without cutting up the sample into smaller pieces, this platform helps preserve device integrity, accelerating failure localization and analysis. These capabilities also enable failure analysis to be extended beyond the lab and into fab environments, where rapid root-cause analysis is critical to improving yield and uptime.

In direct comparison with other sample preparation methods for failure analysis, the new microPREP L provides a multitude of advantages.

Key Features and Benefits

• Sample Scalability: Supports whole wafers up to 12 inches and large board-level devices—enabling failure analysis in both lab and fab environments—while offering a roadmap for even larger samples in future system extensions
• Selective Laser Ablation: Enables precise, localized material removal without destroying or damaging the regions of interest
• In-Situ Process Monitoring: Real-time depth sensing and ablation control ensures high accuracy—reducing rework and improving overall yield in failure analysis workflows
• Automated Workflows: Designed for high-throughput and repeatable operation with minimal operator intervention
• Multi-Sample Workflow Efficiency: Since the microPREP L can handle much larger sample sizes, customers can prepare multiple samples directly on the wafers or system-level boards in a single workflow without process restarts
• FIB/SEM Workflow Integration: Offloads bulk removal to the laser system, optimizing downstream tool use
• Customizable Recipes: Flexible for diverse materials and geometries

Significant Productivity Gains

In benchmark tests, a single operator using the microPREP L was able to prepare up to 32 samples per day, sufficient to feed up to seven plasma FIB systems—dramatically increasing throughput and reducing overall time-to-sample. In another case, a task that took just 23 minutes on the system would have taken up to six months using traditional gallium FIB milling.

“As semiconductor devices become more complex with the rise of heterogeneous integration, multi-layer architectures, and tighter development cycles, traditional sample preparation methods are no longer sufficient for advanced process development and failure analysis,” stated Uwe Wagner, CEO of 3D-Micromac AG. “Our new microPREP L system addresses these challenges head-on by enabling fast, precise, and damage-free sample prep at the wafer and system level. With its unmatched scalability and automated workflows, microPREP L is designed to meet the evolving needs of advanced semiconductor sample prep in both R&D and production environments.”

3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device, and electronics markets, has extended its distribution network into the Turkish market.

3D-Micromac AG announces Mems Enerji Sistemleri as new sales agency in Turkey. Mems Enerji Sistemleri has more than 50 years of market distribution experience for micro and nano fabrication companies. With experience especially in glass and semiconductor markets, Mems is the ideal partner to promote 3D-Micromac’s technologies in the region.

“We are convinced that our customers will appreciate the versatility, speed, and precision of 3D-Micromac AG’s laser micromachining solutions”, says Mehmet Türken, CEO of Mems Enerji Sistemleri.

Frank Richter, Head of Sales at 3D-Micromac AG, is looking forward to a close collaboration: “With Mems’ many years of experience and excellent market knowledge, we see great potential for opening up new customer groups in Turkey and further strengthening existing partnerships.”

About 3D-Micromac

Founded in 2002, 3D-Micromac AG is the industry leader in laser micromachining, delivering powerful, user-friendly and leading-edge processes with superior production efficiency. We develop processes, machines and turnkey solutions at the highest technical and technological level. 3D-Micromac systems and services have been successfully implemented in various high-tech industries worldwide including photovoltaic, semiconductor, glass and display industries, micro diagnostics, and medical technology. For more information, visit the company’s website at http://www.3d-micromac.com.

Contact:

3D-Micromac AG

Claudia Radelow
Team Leader Marketing and Public Relations 3D-Micromac AG
Phone: +49 371 40043-922
E-mail: radelow@3d-micromac.com

HIGHLIGHTS

• 3D-Micromac’s microPREP PRO FEMTO receives the Laser Focus World Innovators Award 2024 in Bronze
• Laser Focus World honors particularly innovative products
• The microPREP PRO FEMTO system is a groundbreaking innovation in high-speed Atom Probe Tomography (APT) and cross-section sample preparation

microPREP PRO FEMTO received the Laser Focus World Innovation Award

Chemnitz, Germany, August 5, 2024—3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic (PV), medical device, and electronics markets, announced today that its microPREP PRO FEMTO laser-based sample preparation system was recognized among the best by the 2024 Laser Focus World Innovators Awards. 2024 Laser Focus World Innovators Award winners are chosen by the qualified judging panel selected by the editorial staff­ at Laser Focus World.

“On behalf of 3D-Micromac AG, I would like to thank the Laser Focus World Awards for awarding us Bronze status” said Uwe Wagner, CEO of 3D-Micromac AG. “We are delighted that our microPREP PRO FEMTO is recognized as an innovative product in the microdiagnostics community.”

The microPREP PRO FEMTO laser micromachining system, developed by 3D-Micromac AG, is honored as a groundbreaking innovation in high-speed Atom Probe Tomography (APT) and cross-section sample preparation. Its unique combination of femtosecond laser technology, optimized optical configurations, increased speed, efficiency, precision and accuracy, non-destructive cleaning capabilities, and versatility offers researchers a faster, more precise, and cost-effective solution for high-speed APT and cross-section sample preparation.

HIGHLIGHTS

• 3D-Micromac AG equips Infineon Technologies Dresden GmbH & Co. KG with production equipment for laser trimming
• The system will be installed in Infineon’s Smart Power Fab for use in the production of analog/mixed-signal technologies and power semiconductors
• Both companies share a goal of installing 3D-Micromac AG’s laser-trimming-systems at more of Infineon’s production sites

Chemnitz, Germany, July, 29, 2024– 3D-Micromac AG, the leading provider of laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaics, glass, and display industries, announced that Infineon Technologies Dresden GmbH & Co. KG has ordered one of 3D-Micromac’s first microVEGA® FC laser-trimming systems for Infineon’s new Smart Power Fab in Dresden, Germany. Designed specifically for Infineon, the microVEGA FC laser-trimming system will be exclusively supplied by 3D-Micromac to Infineon Dresden who is utilizing this advanced technology for its semiconductor laser-trimming applications for the new Smart Power Fab.

The order was preceded by a joint-development project in which 3D-Micromac’s laser-trimming process was transferred into a mass-production-capable laser system. The basis for the new solution was the microVEGA system – a system that has already been utilized successfully to process up to 300-mm (12-inch) semiconductor wafers in several industrial use cases.

The laser beam of the microVEGA FC is shaped in the single-digit micrometer range and moves continuously over semiconductor chips. During this motion, the laser selectively processes defined microstructures of several dies. This trimming process adjusts the resistance value in individual IC chips to a target value. The small size of the dies’ structures (approximately 1-2 micron) and the resulting extremely high demands on the three-dimensional positioning accuracy of the laser spot in relation to the structures place the highest demands on the machine hardware. The microVEGA FC includes an integrated measuring technology to achieve 100-percent process control, overcoming a particular challenge in semiconductor laser-trimming applications. The microVEGA FC system features fully automatic handling for 200-mm and 300-mm wafers. At process speeds of up to 400 mm/s, the system achieves a positioning accuracy of ±200 nm (at 3 Sigma).

Infineon plans to begin manufacturing analog/mixed-signal technologies and power semiconductors in Dresden’s Smart Power Fab in the fall of 2026. The interaction of power semiconductors and analog/mixed-signal components enables particularly energy-efficient and intelligent system solutions commonly used in power supply systems, such as energy-efficient chargers, smaller engine control units for cars, data centers, and Internet of Things (IoT) applications.

Infineon has decided to work with 3D-Micromac to adopt advanced European production technology. Raik Brettschneider, managing director of Infineon Dresden, states, “3D-Micromac’s experience and innovative strength, as well as the close exchange between the specialists of both companies, led to the joint development project’s success. Together, we have paved the way for the microVEGA FC and its future use in Infineon’s production chain. We are content that we can now order the first 3D-Micromac system.”

Both companies share a goal of installing 3D-Micromac AG’s laser-trimming systems at more of Infineon’s production sites. “We are pleased that Infineon decided to go with 3D-Micromac as their supplier for laser-trimming technologies,” Uwe Wagner, CEO of 3D-Micromac AG, concludes. “We are proud to support the European Commission’s goal of increasing the European share of semiconductor production and helping to secure value chains in key European countries.”

3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device and electronics markets, today announced the order intake for a microVEGA® xMR selective laser annealing system from Multidimension Technology Co., Ltd.  Multidimension Technology (MTD) is one of the leading manufacturer of innovative high-performance, low-cost TMR magnetic sensors based in Zhangjiagang (Jiangsu Province, China), with branch offices in Ningbo, Shanghai, Chengdu and San Jose (Califonia, USA) will be using the microVEGA xMR for the production of TMR magnet sensors.

The microVEGA xMR selective laser annealing system provides several advantages over thermal annealing, that is traditionally used for magnetic sensor manufacturing. These advantages include higher precision that enable the processing of smaller magnetic device structures. This results in more devices per wafer, as well as the ability to set different reference magnetization directions on sensors across a single wafer. In addition, the microVEGA’s on-the-fly spot and variable laser energy provide the possibility of selective heating of the pinning layer in each sensor to “imprint” the intended magnetic orientation. Also, magnetic field strength and orientation is adjustable by recipe. High-temperature gradients ensurea low thermal impact on the sensors. Therefore, sensors can be processed directly next to read-out electronics as well as closer together. Such being the case, the production of smaller sensors becomes possible — which allows to process more devices per wafer with microVEGA xMR. Reduced process steps, simplified production flow, higher yield, and more cost-effective production of integrated monolithic sensor packages are the results.

More information on the microVEGA xMR selective laser annealing system is also available on https://3d-micromac.com/laser-micromachining/laser-micromachining-systems/microvega-xmr/ and in the whitepaper “Monolithic Magnetic Sensors Manufactured by Selective Laser Annealing” that is available on lasersensorformation.com.

Chemnitz, Germany, July 28, 2024— 3D-Micromac AG, the leading provider of laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaics, glass, and display industries, announced that Infineon Technologies Dresden GmbH & Co. KG has ordered one of 3D-Micromac’s first microVEGA® FC laser-trimming-systems for Infineon’s new Smart Power Fab in Dresden, Germany. Designed specifically for Infineon, 3D-Micromac is the exclusive supplier of the microVEGA FC laser-trimming system to Infineon Dresden, who is utilizing this advanced technology for its semiconductor laser-trimming applications for the new Smart Power Fab.

The order was preceded by a joint development project in which 3D-Micromac’s laser-trimming process was transferred into a mass-production-capable laser system. The basis for the new solution was the microVEGA system – a system that has already been utilized successfully to process up to 12-inch semiconductor wafers in several industrial use cases.

The laser beam of the microVEGA FC is shaped in the single-digit micrometer range and moves continuously over semiconductor chips. During this motion, the laser selectively processes defined microstructures of several dies. This trimming process adjusts the resistance value in individual IC chips to a target value. The small size of the dies’ structures (approximately 1-2 µm) and the resulting extremely high demands on the three-dimensional positioning accuracy of the laser spot in relation to the structures place the highest demands on the machine hardware. The microVEGA FC includes an integrated measuring technology to achieve 100 percent process control, overcoming a particular challenge in semiconductor lase-trimming applications. The microVEGA FC system, developed by 3D-Micromac, features fully automatic handling for 8- and 12-inch wafers. At process speeds of up to 400 mm/s, the system achieves a positioning accuracy of ±200 nm (at Sigma 3).

Infineon plans to begin manufacturing analog/mixed-signal technologies and power semiconductors in Dresden’s Smart Power Fab in the fall of 2026. The interaction of power semiconductors and analog/mixed-signal components enables particularly energy-efficient and intelligent system solutions commonly used in power supply systems, such as energy-efficient chargers, smaller engine control units for cars, data centers, and Internet of Things (IoT) applications.

Infineon has decided to work with 3D-Micromac to adopt advanced European production technology. Raik Brettschneider, managing director of Infineon Dresden, states, “3D-Micromac’s experience and innovative strength, as well as the close exchange between the specialists of both companies, led to the joint development project’s success. Together, we have paved the way for the microVEGA FC and its future use in Infineon’s production chain. We are content that we can now order the first 3D-Micromac system.” Both companies share a goal of installing 3D-Micromac AG’s laser-trimming-systems at more of Infineon’s production sites. “We are pleased that Infineon decided to go with 3D-Micromac as their supplier for laser-trimming technologies,” Uwe Wagner, CEO of 3D-Micromac AG, concludes. “We are proud to support the European Commission’s goal of increasing the European share of semiconductor production and helping to secure value chains in key European countries.”

Laser annealing improves power device performance

According to Yole Intelligence, the silicon carbide (SiC) power device market is projected to achieve a compound annual growth rate (2021-2027) of more than 30 percent to reach beyond US$6 billion in 2027(1). Benefits of SiC power devices include boosting power efficiency and minimizing energy loss in electric vehicles (EVs), hybrid EVs, power supplies, and solar and wind inverters. While much goes into the development of SiC power devices, the formation of ohmic contacts on the backside of these devices plays a key role in defining their electrical characteristics and mechanical strength.

The microPRO™ XS OCF system from 3D-Micromac is ideally suited for ohmic contact formation (OCF) in SiC power devices due to its high precision and repeatability, and low thermal leakage, which prevent thermal damage to the wafer frontside that can negatively affect device performance. The system features a UV-wavelength diode-pumped solid-state laser source with nano-second pulses and spot scanning to process the entire metalized backside of SiC wafers while preventing the generation of large carbon clusters and heat-related damage to the frontside of the wafer. New features include:

• Large energy density process window that ensures constant stable forward voltage, leading to higher uptime and yield
• Special tool design that minimizes footprint and lowers cost of ownership
• Ability to process 200-mm SiC wafers without stitching, which avoids the creation of dead zones that can negatively impact yield and device quality

Chemnitz, Germany, June 13, 2023— In order to strengthen the competitiveness of the European photovoltaic industry and create appeals for investments, the EU funding project “HighLite” was launched in 2020. The project, which involved 18 European partners from research and industry, ended in May 2023.

3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, glass, and display markets, developed within the framework of the “HighLite” project the new microCELL MCS, a high-throughput system for cutting solar cells.

At one of the final meetings at the Interuniversity Microelectronics Centre (imec), Belgium, the project results were presented to representatives of the European Commission.

The project’s main goal was to develop knowledge-based production solutions for solar modules with high performance, low cost, and excellent environmental characteristics. One part of the project was developing production solutions for cutting and assembling 100 to 160 µm thin silicon heterojunction (SHJ) solar cells into modules in shingle design with high efficiencies. Therefore 3D-Micromac developed the high throughput system microCELL MCS for cutting half cells, 1/3 cells up to 1/6 cell strips for wafer sizes up to M12+ (G12+). Based on the patented TLS-Dicing® technology, the high-precision laser system separates solar cells with clean and microcrack-free edges. The laser system significantly contributes to increasing module output with a throughput of more than 6,000 wafers per hour. The development of this system was an essential step toward achieving the HighLite project goals.

Well-known representatives of the European photovoltaic product industry have successfully applied the microCELL MCS laser system. Among them are, for example, Heckert Solar GmbH from Germany and the Italian energy group Enel S.p.A. At the 3D-Micromac site in Chemnitz, microCELL MCS systems are permanently available to process applications and contract manufacturing orders.