Chemnitz, Germany, July 5, 2023—3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, glass and display markets, today announced that new developments with its laser micromachining solutions used in manufacturing power devices, magnetic sensors, and microLEDs, as well as in semiconductor advanced packaging, will be highlighted at SEMICON West, to be held July 11-13, 2023 in San Francisco.
“Since the first working laser was developed more than 60 years ago, lasers have been used in a wide array of industrial markets. Within the semiconductor industry, lasers play many roles, from wafer dicing, surface structuring, and sample preparation to ablation, sintering, via drilling and patterning. As the leading specialist in laser micromachining, 3D-Micromac offers cost-effective, scalable and versatile products and solutions to support our customers’ needs from development and prototyping through volume production. We look forward to highlighting these solutions, as well as the many applications that they enable, next week at SEMICON West,” stated Uwe Wagner, CEO of 3D-Micromac.