Whether Standard System or Special Solution: We Optimize your Processes!

The all-new microPREP PRO is the first instrument to enable fast, clean, and efficient laser ablation for sample preparation in TEM, X-SEM, XRM, APT, and micromechanical testing.

The microCELL solutions are a highly productive laser systems for Laser Contact Opening (LCO) of high efficient PERC solar cells as well as laser dicing of full cells into half cells with Thermal Laser Separation (TLS-Dicing),

The microSHAPE laser systems are modular platforms designed for high accuracy cutting, drilling and structuring of glass and sapphire substrates.

The microDICE laser micromachining system leverages TLS-Dicing (thermal laser separation) – a unique technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si) and silicon carbide (SiC), into dies with outstanding edge quality while increasing manufacturing yield and throughput.

The microMARK laser systems are suitable for laser engraving of all types of ophthalmic lenses, e.g. prescription and sunglasses, or contact lenses. All systems use UV lasers for permanent marking.

We focus on laser micromachining of virtually any material using short-pulse and ultra-short pulse lasers as well as short wave lasers (UV). Because of our many years of experience in laser technology our machines achieve the best processing results in the µm and sub-µm range.