High Throughput Laser Lift-Off System

3D-Micromac’s microMIRA™ LLO system provides highly uniform, force-free lift-off of different layers on wafers at high processing speed. The unique line  beam system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer’s unique requirements.

The laser system can be used for a variety of applications, such as GaN lift-off from glass and sapphire substrates in microLED display manufacturing as well as in semiconductor manufacturing.

Additional applications include laser annealing and crystallization for surface modification.

Learn more about microMIRA™ and download our latest Whitepaper for free!


Please contact our technical sales team for more information.

Frank Richter
Tel: +49 371 40043-222

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