High Throughput Laser Lift-Off System

3D-Micromac’s microMIRA LLO system provides highly uniform, force-free lift-off of different layers on wafers at high processing speed. The unique line  beam system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer’s unique requirements.

The laser system can be used for a variety of applications, such as GaN lift-off from glass and sapphire substrates in microLED display manufacturing as well as in semiconductor manufacturing.

Additional applications include laser annealing and crystallization for surface modification.

Learn more about microMIRA and download our latest Whitepaper for free!


Please contact our technical sales team for more information.

Frank Richter
Tel: +49 371 40043-222

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