microPRO™ XS OCF

Selective Laser Annealing for Ohmic Contact Formation (OCF)

The microPRO XS system provides laser annealing with high repeatability and throughput in a versatile system. Combining a state-of-the-art laser optic module with 3D-Micromac’s modular processing platform, the microPRO XS is ideally suited for ohmic contact formation (OCF) in silicon carbide (SiC) power devices.

The microPRO XS OCF features a UV-wavelength diode-pumped solid-state (DPSS) laser source with nano-second pulses and spot scanning to process the entire metalized backside of SiC wafers. It forms ohmic interfaces and cures grinding defects, while preventing the generation of large carbon clusters and heat-related damage to the front-side of the wafer.

Learn more about Selective Laser Annealing for Ohmic Contact Formation (OCF) and download our latest Whitepaper for free!


Please contact our technical sales team for more information.

Frank Richter
Tel: +49 371 40043-222

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