microPRO™ XS OCF

Selective Laser Annealing for Ohmic Contact Formation (OCF)

The microPRO XS system provides laser annealing with high repeatability and throughput in a versatile system. Combining a state-of-the-art laser optic module with 3D-Micromac’s modular processing platform, the microPRO XS is ideally suited for ohmic contact formation (OCF) in silicon carbide (SiC) power devices.

The microPRO XS OCF features a UV-wavelength diode-pumped solid-state (DPSS) laser source with nano-second pulses and spot scanning to process the entire metalized backside of SiC wafers. It reduces particle generation due to process routine and chamber layout.

Learn more about Selective Laser Annealing for Ohmic Contact Formation (OCF) and download our latest Whitepaper for free!


Please contact our technical sales team for more information.

Frank Richter
Tel: +49 371 40043-222

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