microPRO™ XS OCF

The microPRO XS system provides laser annealing with high repeatability and throughput in a versatile system. Combining a state-of-the-art laser optic module with 3D-Micromac’s modular processing platform, the microPRO XS is ideally suited for ohmic contact formation (OCF) in silicon carbide (SiC) power devices.

The microPRO XS OCF features a UV-wavelength diode-pumped solid-state (DPSS) laser source with nano-second pulses and spot scanning to process the entire metalized backside of SiC wafers. It forms ohmic interfaces and cures grinding defects, while preventing the generation of large carbon clusters and heat-related damage to the front-side of the wafer.