Get Access to the Exclusive Whitepaper on

Ultra-Precise Laser Processing with microVEGA® FC

Get Access to the Exclusive Whitepaper on

Ultra-Precise Laser Processing with microVEGA® FC

Imagine a horseback archer firing 80,000 arrows per second at match heads — while galloping — and hitting each one with sub-hair accuracy.

That’s the level of control our laser system achieves while processing semiconductor wafers at 400 mm/s.
Discover how 3D-Micromac AG and Eitzenberger GmbH have redefined motion precision and dynamic stability in high-throughput laser micromachining.

Download the whitepaper “Precision in Motion: Revolutionizing Wafer-Level Laser Processing through Synergistic Laser and Air Bearing Positioning Systems” now.

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I agree that a personal user profile is created based on my data. This enables 3D-Micromac AG to send me information that corresponds to my specific interests. I agree that my personal usage behavior in dealing with all e-mails and web pages of 3D-Micromac AG might be recorded through the use of cookies and tracking technology. I can revoke my consent to the creation of a personal user profile at any time. Furthermore, I have the option to revoke my consent by using the tracking unsubscribe link in each newsletter.

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I agree to receiving newsletters about products, services, market trends and its own promotions from 3D-Micromac AG. Granting this consent is a prerequisite for the completion of this registration. After registration I can revoke the consent at any time. I can send a revocation of consent to marketing@3d-micromac.com. I can also declare the revocation of consent to 3D-Micromac AG by fax or by mail. Furthermore, I have the option to revoke my consent by using the unsubscribe link in each newsletter. Upon receipt of the objection, 3D-Micromac will immediately stop the mailings.

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