Get Access to the Exclusive Whitepaper on
Ultra-Precise Laser Processing with microVEGA® FC
Imagine a horseback archer firing 80,000 arrows per second at match heads — while galloping — and hitting each one with sub-hair accuracy.
That’s the level of control our laser system achieves while processing semiconductor wafers at 400 mm/s.
Discover how 3D-Micromac AG and Eitzenberger GmbH have redefined motion precision and dynamic stability in high-throughput laser micromachining.
Download the whitepaper “Precision in Motion: Revolutionizing Wafer-Level Laser Processing through Synergistic Laser and Air Bearing Positioning Systems” now.
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