CSE Jiufengshan Forum 2026
April 23rd – 25th, 2026
Meet 3D-Micromac at CSE Forum 2026 in Wuhan, China!
The CSE Forum takes place from April 23 to 25 and will bring together over 300 exhibitors, including many industry leaders. And you can learn about global compound semiconductor trends, discuss the latest technologies, and explore a wide range of products, services, and solutions.
Our key topics at CSE:
- Laser modification for TGV
- Glass and advanced substrate processing (AR glasses cutting)
- Micro-structuring solutions for advanced packaging and optical applications
We look forward to meeting you at booth 3A47.
We will be collaborating on-site with our business partner, DYMEK, to ensure effective communication in this technology sector.

