ECTC 2026

May 26th – May 29th 2026

Meet 3D-Micromac at the IEEE 76th ECTC 2026 in Orlando, Florida, USA!

The Electronic Components and Technology Conference (ECTC) is a leading international forum for packaging technologies, system integration, and microelectronic components. From May 26–29, 2026, the IEEE ECTC will once again bring together experts from industry and research—this time in Las Vegas—to discuss current trends and technical innovations. The symposium is accompanied by a high-level technical exhibition.

AT ECTC, 3D-Micromac will showcase laser micromachining solutions specifically developed to meet the demanding requirements of advanced packaging and sample preparation:

microPREP PRO Lfor laser-based sample preparation for failure analysis and material characterization
Laser annealing systems for TMR sensor– and SiC Power Device manufacturing
microVEGA FC for laser link trimming in analog ICs

We are looking forward to your visit!

You can find us on booth 145.