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Selective Laser Annealing for Ohmic Contact Formation (OCF)

Learn more about 3D-Micromac’s laser annealing process for OCF on the backside of SiC wafers. Find out how this innovative process protects the sensitive wafer frontside from thermal damages that can negatively affect the device performance. Sounds interesting?

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Please fill in the required fields to receive our whitepaper.
Please fill in the required fields to receive our whitepaper.

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I agree to receiving newsletters about products, services, market trends and its own promotions from 3D-Micromac AG. Granting this consent is a prerequisite for the completion of this registration. After registration I can revoke the consent at any time. I can send a revocation of consent to marketing@3d-micromac.com. I can also declare the revocation of consent to 3D-Micromac AG by fax or by mail. Furthermore, I have the option to revoke my consent by using the unsubscribe link in each newsletter. Upon receipt of the objection, 3D-Micromac will immediately stop the mailings.

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