SEMICON KOREA 2026
February 11th – February 13, 2026
This exhibition will showcase the latest semiconductor materials, equipment, and related technologies. With special features including Semiconductor Technology Symposium, Market Trend Forum and Supplier Search Program.
We are looking forward to meeting you at booth A354.
Together with our partner Woowon Technology Co. Ltd, we are presenting laser micromachining technologies that solve important needs in semiconductor industry:
- Laser annealing systems for:
- Forming ohmic contacts (OCF) on SiC power devices
- Selective reference layer pinning in TMR sensors
- Selective frontside annealing
- Laser dicing systems for the separation of semiconductor wafers & singulation of substrates for advanced packaging
- Laser-based sample preparation systems enabling materials characterization
- Laser link trimming systems for the adjustment & calibration of analog ICs & sensors
- Laser drilling systems enabling heterogeneous integration & glass core technology
