IPFA 2026

Meet 3D-Micromac at IPFA 2026 in Singapore!

IPFA (The International Symposium on the Physical and Failure Analysis of Integrated Circuits) is a cornerstone conference for Semiconductor Failure Analysis and Reliability Assessment. From July 13th – 16th over 500 participants, including academics, industry experts, and vendors/exhibitors will join the event.

3D-Micromac will present the microPREP PRO systems, which enable fast and flexible laser-based sample processing.

We are looking forward to meeting you there. You will find us at the booth of our sales partner EXTRAD.

Our key topics: Failure Analysis | Sample Preparation | APT | TEM | FIB/SEM | Material Characterization | Processing wafers and system-level boards