Chemnitz, Germany, September 18, 2017—3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, today unveiled the microPRO RTP—its new laser annealing system designed to enable several key process steps in semiconductor, power device and MEMS manufacturing.
Combining a state-of-the-art laser optic module with 3D-Micromac’s highly modular semiconductor wafer dicing platform, the microPRO RTP provides selective annealing with high repeatability and high throughput. The system features a line scan option for vertical selective annealing and a step-and-repeat spot option for horizontal selective annealing, as well as three optional wavelength lasers (near infrared, green and ultraviolet), resulting in a highly flexible, high-quality laser annealing platform.
The microPRO RTP has demonstrated the ability to address a wide variety of existing and emerging applications, including:
• Dopant activation for insulated gate bipolar transistors (IGBT) and backside illuminated (BSI) CMOS image sensors
• Ohmic contact formation in silicon carbide (SiC) power devices to improve resistance
• The manufacture of certain types of MEMS devices such as semiconductor magnetic field sensors