microMIRA™

3D-Micromac’s microMIRA LLO system provides highly uniform, force-free lift-off of different layers on wafers at high processing speed. The unique line  beam system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer’s unique requirements.

The laser system can be used for a variety of applications, such as GaN lift-off from glass and sapphire substrates in microLED display manufacturing as well as in semiconductor manufacturing.

Additional applications include laser annealing and crystallization for surface modification.