dpiX and 3D-Micromac America today announced the signing of a Memorandum of Understanding (MOU) that outlines the companies’ cooperation in the development, prototyping and manufacturing of laser-manufactured flat panel sensor semiconductors.
dpiX and 3D-Micromac America envision that the partnership will enhance the value chains for the U.S.-based, multi-segment semiconductor foundry operated by dpiX and the semiconductor and display segments of 3D-Micromac America’s business.“For over 20 years, we have been and continue to be the worldwide market leader in flat panel optical sensors for radiology. With great pride, we now see that our foundry services are also rapidly attracting strategic partners in R&D, prototyping and manufacturing for different types of flat panel semiconductors” said Frank Caris, CEO and president of dpiX.
dpiX and 3D-Micromac share the belief that their combined strengths – a U.S.-based semiconductor facility, industry-leading research and development (R&D), product development and end-product manufacturing capabilities – will contribute to the United States retaining and expanding upon these unique value chains to meet U.S. demand and compete internationally. Seeing these goals to fruition, however, requires appropriate funding. Both companies are monitoring progress of the CHIPS for America Act, the Biden-Infrastructure Plan and the Strategic Competition Act, with great anticipation.
“Partnering with dpiX means contributing precision laser expertise to a worthy endeavor. We look forward to adding a new dimension to the team and enhancing overall U.S. competitiveness in the sensor, display and electronics arena,” said Brian Hoekstra, president of 3D-Micromac America.