3D-Micromac America and Coherent, Inc sign collaborative agreement to provide high-precision test platform for micromachining applications

3D-Micromac America, LLC (3D-Micromac America) and Coherent, Inc. (Coherent) announced today that they have entered into an agreement where 3D-Micromac America will provide a state-of-the-art test platform to Coherent for micromachining and other precision laser applications development. In exchange, Coherent will help facilitate the localization of precision, laser-based motion system equipment for 3D-Micromac America, a subsidiary of Germany-based 3D-Micromac AG.

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3D-Micromac enables high-performance and cost-effective dicing of SiC wafers

Product launch of microDICE™ laser dicing system using TLS-Dicing™ technology (Thermal-Laser-Separation) at Semicon West 2014

microDICE

3D-Micromac AG, a leading supplier of state-of-the-art laser micromachining workstations, today introduced the microDICE™ system which brings TLS-Dicing™ technology (Thermal-Laser-Separation) to semiconductor‘s back-end. The microDICETM separates wafers, including SiC, into dies with an outstanding edge quality while increasing the yield and the throughput.

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3D-Micromac shows novel laser processing solutions at Semicon West 2014

For the first time 3D-Micromac AG will present its microDICE™ laser dicing system and further innovative solutions for processing of semiconductors at Semicon West 2014

microDICE

3D-Micromac AG, a leading supplier of state-of-the-art laser micromachining workstations, will present novel laser applications for semiconductor industry at Semicon West 2014 in San Francisco, CA from July 8 to July 10, 2014.

For the first time, 3D-Micromac will show the high-performance microDICE™ laser dicing system which brings TLS-Dicing™ technology (Thermal-Laser-Separation) to semiconductor‘s back-end. The microDICE™ separates wafers, including SiC, into dies with an outstanding edge quality while increasing the yield and the throughput. Compared to traditional separation technologies microDICE™ provides a much higher process speed and better throughput enabling high-volume production of SiC based devices.

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