The Future is Flexible - 3D-MICROMAC at Drupa 2012

New sales partner in Japan

3D-Micromac founds subsidiary company Hikali KK

3D-Micromac AG has founded the independent distribution company Hikali KK, domiciled in Sagamihara, Japan, on 1st March 2012. The term “Hikali“ or “Hikari“ is the Japanese term for “light“ and “working with light”, respectively.

The company’s Executive Director is Mr. Akimi Watanabe, a longtime business partner of 3D-Micromac. Mr. Watanabe has 27 years of experience in laser technology and micromachining. He is the founder and former CEO of Beams Inc. which he left in February 2012.

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3D-Micromac honored with “Excellence Award”

Innovative and powerful laser micromachining system microFLEX is one of the convincing new products

Excellence Award

On occasion of the “Taiwan Printed Circuit Association Show”, one of the world’s largest trade fairs for material and production technologies in the printed circuit board industry, and the “Taiwan Laser Application Forum“, 3D-Micromac AG was honored with an „Excellence Award“ in November 2011. 

The company received this award for the development of the new, innovative laser micromachining system microFLEXTM, which is used for laser processing of thin films on flexible substrates.

The system works by way of reel-to-reel laser processing and is therefore able to reduce the cost for the production of components, like sensors and RFID-chips, drastically. Besides, the company was praised for its continuous engagement in industry-oriented research work in Taiwan.


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High throughput laser treatment of thin film panels

3D-Micromac presents new laser machining system microSCRIBE

At 26th EU PVSEC taking place from 5 - 8 September 2011, 3D-Micromac AG will present its new laser processing system microSCRIBETM for machining of thin film panels for the first time.

The laser micromachining system microSCRIBETM is suitable for structuring of large panel thin film solar cells, for example the processing of CIS or CIGS modules, but also for other thin film technologies such as cadmium telluride, amorphous silicon, microcrystalline silicon or micromorphous silicon. Typical processing methods for existing thin film technologies are the material removal at the panel edge to produce an electrical insulation to the panel frame and the surface structuring of thin layers in steps P1, P2 and P3.

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New Design Line

Flexibility meets design

raumschiff
New Design Line

Just in time for LASER World of Photonics 2011, 3D-Micromac AG is presenting its all new design concept that is applied to the microSTRUCT CTM laser system for the first time.

The company's new design line stands for modernity, flexibility and uniqueness. The goal of the new design development was the creation of uniform design features that can be adapted to future 3D-Micromac products. The modular design enables a flexible adaption to different machine layouts and requirement scenarios. The softly curved front is optically divided by a circular belt in the form of a deflected laser beam. Significantly bigger and wide swiveling doors to open the machine guarantee both an ideal loading and accessing to the machine.

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New picosecond laser system microSTRUCT compact

Gently processing by use of ultra short pulse lasers

microstruct compact
microSTRUCT compact

Caused by a progressing trend to miniaturization in electronics, semi-conductor production and medical engineering it is compulsory necessary to reach continually smaller and more particularized structures in various substrates. Traditional production technologies reach their limits. The processing by ultra short pulse lasers offers best conditions for the required quality and precision due to an almost athermal ablation.

Therefore, 3D-Micromac AG developed a compact, modular constructed system for processing with ultra short pulse lasers in order to fit these requirements and successfully placed it on the market. In addition to an individual design of this system, 3D-Micromac focused on high quality, precision, reliability and flexibility.

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