3D-Micromac introduces all-new system for high-throughput microdiagnostic sample preparation at ISTFA 2014

For the first time 3D-Micromac AG presents its laser-based sample preparation tool microPREP™

microPREP

3D-Micromac AG, a leading supplier of state-of-the-art laser micromachining systems, introduces a novel laser system for high-throughput microdiagnostic sample preparation at ISTFA 2014 in Houston, Texas from November 11 to November 12, 2014.

The all-new microPREP™ system for laser-based sample preparation was developed to provide efficient laser micromachining fitted to the needs of microstructure diagnostics and failure diagnostics. Based on patented processing, 3D-Micromac’s microPREP™ is ready to do the laser cutting of a base structure followed by local laser thinning in an almost entirely automated fashion.

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3D-Micromac America and Coherent, Inc sign collaborative agreement to provide high-precision test platform for micromachining applications

3D-Micromac America, LLC (3D-Micromac America) and Coherent, Inc. (Coherent) announced today that they have entered into an agreement where 3D-Micromac America will provide a state-of-the-art test platform to Coherent for micromachining and other precision laser applications development. In exchange, Coherent will help facilitate the localization of precision, laser-based motion system equipment for 3D-Micromac America, a subsidiary of Germany-based 3D-Micromac AG.

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3D-Micromac enables high-performance and cost-effective dicing of SiC wafers

Product launch of microDICE™ laser dicing system using TLS-Dicing™ technology (Thermal-Laser-Separation) at Semicon West 2014

microDICE

3D-Micromac AG, a leading supplier of state-of-the-art laser micromachining workstations, today introduced the microDICE™ system which brings TLS-Dicing™ technology (Thermal-Laser-Separation) to semiconductor‘s back-end. The microDICETM separates wafers, including SiC, into dies with an outstanding edge quality while increasing the yield and the throughput.

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