3D-Micromac AG acquires TLS-Dicing® from Jenoptik

Laser technology for separating microchips complements the Chemnitz company's product portfolio.

Chemnitz, Jan 16, 2014 - Jenoptik and 3D-Micromac AG announce the technology transfer of thermal laser separation (TLS-Dicing®) as part of a so-called asset deal. As of January 1, 2014, know-how, patents and results of the development from Jenoptik's Laser & Materials Processing Division are transferred to 3D-Micromac AG in Chemnitz. 

Read more …

 

3D MicroPrint GmbH: EOS and 3D-Micromac are bringing Micro Laser Sintering technology into a newly-established business enterprise

Initial fields of application identified in the automotive, medical and jewellery industries

3D-Micromac AG in Chemnitz, a leading provider of highly efficient laser micromachining systems, and EOS GmbH, a technology and market leader for design-driven, integrated e-Manufacturing solutions in additive manufacturing, are bringing their respective technological know-how in the area Micro Laser Sintering technology (MLS) into a new corporation. The goal of establishing 3D MicroPrint GmbH was to advance the development and commercialization of the new MLS technology, and to identify and establish more solutions in the field of micro technology. 

Read more …

 

3D-Micromac wins Solar Industry Award with microSCRIBE OSP

The new One-Stop Patterning technology convinced in the category Thin-Film Innovation

The winners of this year’s Solar Industry Awards have been acknowledged: 3D-Micromac AG received the award for its production system microSCRIBE OSP in the category Thin-Film Innovation.

The microSCRIBE OSP is first production equipment worldwide that can conduct the integrated series-connection of a thin- film solar module on one single platform and in one single production step. The new One-Stop Patterning process (OSP) only structures the modules once all of the functional layers have been deposited on the substrate. This significantly simplifies the production process. In addition, the new process prevents inaccuracies, which are caused when the substrate is positioned and aligned on different tables – an improvement which increases the efficiency of a thin-film module by up to 0.8%

Read more …