3D-Micromac AG, a leading supplier of state-of-the-art laser micromachining workstations, will present novel laser applications for semiconductor industry at Semicon West 2014 in San Francisco, CA from July 8 to July 10, 2014.

For the first time, 3D-Micromac will show the high-performance microDICE™ laser dicing system which brings TLS-Dicing™ technology (Thermal-Laser-Separation) to semiconductor‘s back-end. The microDICE™ separates wafers, including SiC, into dies with an outstanding edge quality while increasing the yield and the throughput. Compared to traditional separation technologies microDICE™ provides a much higher process speed and better throughput enabling high-volume production of SiC based devices.