Laser structuring with micrometer accuracy for large and oversized substrates

3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, presents its microSHAPE laser systems for processing large and flat substrates at Laser World of Photonics 2019, taking place from June 24 to 27 in Munich, Germany.

The modular microSHAPE platform is used in all applications where highly dynamic laser processing with precision requirements in the micrometer range on substrates up to 2,000 × 6,000 mm in size are to be realized. Applications include structuring and cutting of glass, surface modifications or structuring of metal substrates as well as the production of printing plates and embossing tools.

The microSHAPE axis system can be flexibly adapted to the application and can be configured to match the process in terms of performance or dynamics. Depending on the configuration level, axis speed of up to 1.5 m/sec., acceleration of 1.5 g and a repeating accuracy of ±1 μm can be achieved. Depending on the application, different beam deflection systems and laser sources can be integrated. For high-efficient processing, high power nanosecond or picosecond lasers are used in combination with highly dynamic 2D / 3D galvanometer scanners or with polygon scanners.

he substrates are inserted and removed in a specially developed handling system, which supplies the substrates semi-automatically or fully automatically to the laser unit. If required this can also be done largely without surface contact. The high-precision alignment of the substrates as a standard is realized automatically. Height variations of the substrates can be easily compensated either by adapted beam shaping or by tracking of the laser focus. 3D-Micromac’s user-friendly machine software processes customer layouts quickly and controls the complete machining process.

Media, analysts and potential customers interested in learning more about 3D-Micromac’s laser systems, including microSHAPE, are invited to visit the company at Laser World of Photonics 2019, June 24-27 at the New Fair Munich in Hall A2, booth #129. More information is also available on https://3d-micromac.com/laser-micromachining/products.

3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, today announced that the total received order volume for its microCELL TLS high-throughput half-cell cutting tools tops 3 GW in 2019.

The microCELL TLS systems use Thermal Laser Separation for separation of standard silicon solar cells into half-cells. The ablation free process guarantees an outstanding edge quality. The separated cells show an approximately 30% higher mechanical strength. By using Thermal Laser Separation, module manufacturers are enabled to guarantee a lower power degradation value over lifecycle of the solar module. Furthermore, a module power gain of 1-2 W was seen with TLS compared to conventional scribe and break methods, in addition to the 5-7 W per module gain of half-cell module technology.

Media, analysts and potential customers interested in learning more about 3D-Micromac’s laser systems for silicon solar cell and flexible photovoltaic, including microCELL TLS, are invited to visit the company at SNEC 2019, June 4-6 at the Shanghai New Int’l Expo Center in Hall N3, booth #111. More information on microCELL is also available on https://3d-micromac.com/laser-micromachining/products/microcell/.

3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, today announced that the total received order volume for its microCELL TLS high-throughput half-cell cutting tools tops 3 GW in 2019.

The microCELL TLS systems use Thermal Laser Separation for separation of standard silicon solar cells into half-cells. The ablation free process guarantees an outstanding edge quality. The separated cells show an approximately 30% higher mechanical strength. By using Thermal Laser Separation, module manufacturers are enabled to guarantee a lower power degradation value over lifecycle of the solar module. Furthermore, a module power gain of 1-2 W was seen with TLS compared to conventional scribe and break methods, in addition to the 5-7 W per module gain of half-cell module technology.

Media, analysts and potential customers interested in learning more about 3D-Micromac’s laser systems for silicon solar cell and flexible photovoltaic, including microCELL TLS, are invited to visit the company at SNEC 2019, June 4-6 at the Shanghai New Int’l Expo Center in Hall N3, booth #111. More information on microCELL is also available on https://3d-micromac.com/laser-micromachining/products/microcell/.