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3D-Micromac extends presence in North America
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3D-Micromac introduces new 3D printing system for manufacturing of micro metal parts at Formnext 2019
3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, is going to introduce its new 3D printing system DMP 74 at Formnext 2019, taking place from November 19th to 22nd in Frankfurt, Germany. The laser system is designed for the series production of complex metal components using micro laser sintering (MLS). It achieves the highest accuracy available with MLS in the additive manufacturing market.
Laser contract manufacturing for the production of components for small and large series
3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device and electronics markets, is adding laser contract manufacturing to its portfolio.
3D-Micromac unveils laser based high-volume preparation solution for semiconductor and materials failure analysis
Chemnitz, Germany, July 9, 2018—3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device and electronics markets, today introduced the microPREP™ 2.0 laser ablation system for high-volume sample preparation of metals, semiconductors, ceramics and compound materials for microstructure diagnostics and failure analysis (FA).
microPREP™ wins the TÜV SÜD Innovation Prize 2018
The TÜV SÜD Innovation Prize has been awarded for the second time, recognizing the successful cooperation of small and medium-sized enterprises with a research institution. The 1st place in the TÜV SÜD Innovation Prize in 2018: 3D-Micromac AG (Chemnitz) and Fraunhofer Institute for Microstructure of Materials and Systems (IMWS). The prize dignifies the successful development of a sample preparation system for microstructure diagnostics and failure diagnostics.
3D-Micromac introduces selective laser annealing system for semiconductor, power device and MEMS manufacturing
Chemnitz, Germany, June 25, 2018—3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device and electronics markets, today unveiled the microPRO™ RTP—its new laser annealing system designed to enable several key process steps in semiconductor, power device and MEMS manufacturing. Combining a state-of-the-art laser optic module with 3D-Micromac’s modular semiconductor wafer processing platform, the microPRO RTP provides selective annealing with high repeatability and throughput in a versatile system.