Introduction to the New Large Volume Workflow for Semiconductor Advanced Packaging Failure Analysis
The webinar will introduce a synergistic workflow, incorporating plasma FIB technology & the addition of a high-speed laser ablation technique
This author has yet to write their bio.
Meanwhile lets just say that we are proud admin contributed a whooping 55 entries.
The webinar will introduce a synergistic workflow, incorporating plasma FIB technology & the addition of a high-speed laser ablation technique
This webinar will provide insights into how these modern specimen preparation techniques can significantly reduce complexity and improve efficiency
microPREP® PRO FEMTO Sample Preparation System from 3D-Micromac honored with 2024 Laser Focus World Innovators Award
Laser micromachining expert exclusively supplies Infineon Dresden with the microVEGA FC laser-trimming system
Join our free webinar on Laser Cutting for Separating Waveguides for AR Devices about cutting high-index glass used for AR waveguides
Join our free webinar on laser drilling of high-precision micro holes about various laser drilling processes 3D-Micromac is capable of.
From 29th September to 04th October 2024, we are going to present our latest product highlights for power device manufacturing at ICSCRM 2024 in Raleigh, North Carolina. Learn more about selective laser annealing for ohmic contact formation (OCF) in silicon carbide (SiC) power devices with our microPRO XS OCF system while meeting our experts at ICSCRM 2024.
Meet us at the microLED connect and find out more about our laser processing solutions for MicroLED production
3D-Micromac to present breakthroughs in laser micromachining for semiconductor manufacturing and advanced packaging at SEMICON West
Successful completion of the EU-funded project “HighLite”