3D-Micromac extends presence in North America
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3D-Micromac introduces new 3D printing system for manufacturing of micro metal parts at Formnext 2019
3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, is going to introduce its new 3D printing system DMP 74 at Formnext 2019, taking place from November 19th to 22nd in Frankfurt, Germany. The laser system is designed for the series production of complex metal components using micro laser sintering (MLS). It achieves the highest accuracy available with MLS in the additive manufacturing market.
Laser contract manufacturing for the production of components for small and large series
3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device and electronics markets, is adding laser contract manufacturing to its portfolio.
Change in the Management Board of 3D-Micromac AG
Chemnitz, 15. August 2018 – The Management board of 3D-Micromac AG has appointed Jan Klinger as Chief Sales Officer and Torsten Scholl as Chief Operation Officer.
3D-Micromac unveils laser based high-volume preparation solution for semiconductor and materials failure analysis
Chemnitz, Germany, July 9, 2018—3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device and electronics markets, today introduced the microPREP™ 2.0 laser ablation system for high-volume sample preparation of metals, semiconductors, ceramics and compound materials for microstructure diagnostics and failure analysis (FA).
3D-Micromac introduces selective laser annealing system for semiconductor, power device and MEMS manufacturing
Chemnitz, Germany, June 25, 2018—3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device and electronics markets, today unveiled the microPRO™ RTP—its new laser annealing system designed to enable several key process steps in semiconductor, power device and MEMS manufacturing. Combining a state-of-the-art laser optic module with 3D-Micromac’s modular semiconductor wafer processing platform, the microPRO RTP provides selective annealing with high repeatability and throughput in a versatile system.
3D-Micromac shows microFLEX laser system for processing of flexible solar cells at SNEC 2018
3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, is presenting its high-throughput microFLEX laser systems for processing of flexible solar cells at the SNEC 2018 International Photovoltaic Power Generation Conference & Exhibition, to be held on May 28th-30th in Shanghai, China.