“As microelectronics adopt 3D/stacked architectures to achieve more functionality, manufacturers need annealing solutions that can process the surface layers of their devices without affecting buried structures underneath. The migration to new materials and heterogeneous integration adds even more complexity to the annealing process, driving the need for selective exposure of functional areas, which only selective laser annealing can provide. Leveraging our years of experience in providing laser solutions to the semiconductor and microelectronics market, 3D-Micromac is pleased to offer our new microPRO RTP laser annealing solution, which provides the selectivity, flexibility and throughput our customers need to meet their unique annealing requirements,” stated Hans-Ulrich Zühlke, product manager at 3D-Micromac.
The microPRO RTP provides numerous advantages compared to existing annealing methods, including:
- High precision and repeatability in both X and Y directions
- High selectivity to different substrates and films, with multiple options for laser pulse length, energy and overlap to ensure no damage to the area surrounding the target site
- Very high energy homogeneity
- Precise process monitoring
- Flexibility to handle substrate diameters ranging from 50mm up to 300mm
Media, analysts and potential customers interested in learning more about 3D-Micromac’s laser micromachining solutions, including the microPRO RTP, are invited to visit the company at SEMICON West 2018, July 10-12 at the Moscone Convention Center in San Francisco, Calif., in South Hall, booth #1645. More information on microPRO RTP is also available on https://3d-micromac.com/laser-micromachining/products/micropro/.