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3D-Micromac CEO to present at TechBlick MiniLED and MicroLED Displays Conference
3D-Micromac announced that its CEO, Uwe Wagner, is presenting at the TechBlick “Mini- & Micro-LED Displays Conference to be held virtually on November 30-December 1.
3D-Micromac receives order for multiple Laser Lift-Off systems for microLED device manufacturing
3D-Micromac announced that a leading optical solutions provider has purchased multiple microMIRA™ Laser Lift-Off (LLO) systems from 3D-Micromac for use in the production of microLED devices.
R2R Laser Scribing of Flexible CIGS Solar Cells
This webinar gives you insights in roll-to-roll (R2R) laser processing of flexible CIGS (copper indium gallium selenide) solar cells. Register now for free!
Roll-to-Roll Laser Processing of Flexible Devices
This webinar will give you a brief overview of different case studies where roll-to-roll laser processing achieved new dimensions in terms of precision, quality and process efficiency.
Cutting out the cracks: Advantages of thermal stress cutting
This webinar provides you insights into Thermal Laser Separation including a comparison between TLS and laser scribing and mechanical cleaving.
Changes in the Management Board of 3D-Micromac AG
Chemnitz, February 1, 2021 – 3D-Micromac AG, the leading specialist in laser micromachining and roll-to-roll laser processing systems, is pleased to announce that as part of its successful strategic realignment, a consortium of US investors has acquired a majority stake in the company. The founder and previous majority shareholder Tino Petsch has also sold part of his share package and will withdraw from the operative business. His former fellow board member, Uwe Wagner, will continue to manage the business of 3D-Micromac AG with overall responsibility for the company.
TESCAN ORSAY Holding, a.s. and 3D-Micromac AG Collaborate to Increase the Efficiency of Failure Analysis Workflows
The synergy between both companies in the joint business and development activities creates a solid base for significant time and cost savings in the failure analysis (FA) workflows when compared to the standard approach.