SPIE AR | VR | MR 2025
3D-Micromac presents the laser processing system microPOLAR at SPIE AR | VR | MR in San Francisco. Visit us at booth 6407!
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Introduction to the New Large Volume Workflow for Semiconductor Advanced Packaging Failure Analysis
The webinar will introduce a synergistic workflow, incorporating plasma FIB technology & the addition of a high-speed laser ablation technique
Femtosecond laser ablation-based preparation methods for high resolution materials characterization
This webinar will provide insights into how these modern specimen preparation techniques can significantly reduce complexity and improve efficiency
microPREP® PRO FEMTO Sample Preparation System from 3D-Micromac honored with 2024 Laser Focus World Innovators Award
microPREP® PRO FEMTO Sample Preparation System from 3D-Micromac honored with 2024 Laser Focus World Innovators Award
3D-Micromac receives laser-trimming-system order from Infineon for new Dresden Smart Power Fab
Laser micromachining expert exclusively supplies Infineon Dresden with the microVEGA FC laser-trimming system
Laser Glass Cutting of Waveguides for AR Devices
Join our free webinar on Laser Cutting for Separating Waveguides for AR Devices about cutting high-index glass used for AR waveguides
Laser Drilling of High-Precision Micro Holes
Join our free webinar on laser drilling of high-precision micro holes about various laser drilling processes 3D-Micromac is capable of.
M&M 2025
Meet 3D-Micromac at the M&M 2025 and learn more about our laser-based sample preparation system microPREP PRO!
3D-Micromac to present breakthroughs in laser micromachining for semiconductor manufacturing and advanced packaging at SEMICON West
3D-Micromac to present breakthroughs in laser micromachining for semiconductor manufacturing and advanced packaging at SEMICON West
LASER World of Photonics 2025
Meet 3D-Micromac at the LASER World of Photonics in Munich to learn more about our capabilities regarding laser micromachining for glass & other substrates.