Laser contract manufacturing for the production of components for small and large series
3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device and electronics markets, is adding laser contract manufacturing to its portfolio.
3D-Micromac unveils laser based high-volume preparation solution for semiconductor and materials failure analysis
Chemnitz, Germany, July 9, 2018—3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device and electronics markets, today introduced the microPREP™ 2.0 laser ablation system for high-volume sample preparation of metals, semiconductors, ceramics and compound materials for microstructure diagnostics and failure analysis (FA).
microPREP™ wins the TÜV SÜD Innovation Prize 2018
The TÜV SÜD Innovation Prize has been awarded for the second time, recognizing the successful cooperation of small and medium-sized enterprises with a research institution. The 1st place in the TÜV SÜD Innovation Prize in 2018: 3D-Micromac AG (Chemnitz) and Fraunhofer Institute for Microstructure of Materials and Systems (IMWS). The prize dignifies the successful development of a sample preparation system for microstructure diagnostics and failure diagnostics.
3D-Micromac introduces selective laser annealing system for semiconductor, power device and MEMS manufacturing
Chemnitz, Germany, June 25, 2018—3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device and electronics markets, today unveiled the microPRO™ RTP—its new laser annealing system designed to enable several key process steps in semiconductor, power device and MEMS manufacturing. Combining a state-of-the-art laser optic module with 3D-Micromac’s modular semiconductor wafer processing platform, the microPRO RTP provides selective annealing with high repeatability and throughput in a versatile system.
3D-Micromac shows microFLEX laser system for processing of flexible solar cells at SNEC 2018
3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, is presenting its high-throughput microFLEX laser systems for processing of flexible solar cells at the SNEC 2018 International Photovoltaic Power Generation Conference & Exhibition, to be held on May 28th-30th in Shanghai, China.
3D-Micromac receives order for new microMIRA excimer laser lift-off system from dpiX for X-ray sensor manufacturing
Chemnitz, Germany, May 16, 2018—3D-Micromac AG, a leading supplier of laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, today announced it has received an order for the company’s new microMIRA excimer laser lift-off (LLO) system from dpiX, a leading manufacturer of high-resolution digital sensors. The microMIRA system will be shipped to dpiX’s fab in Colorado Springs, Colo., where it will provide laser lift-off processing from Gen 4.5 glass substrates used in manufacturing X-ray sensors for medical, industrial and military applications.
3D-Micromac unveils clean scribe technology on microDICE TLS laser dicing system for low-cost, particle-free dicing of silicon carbide wafers
Chemnitz, Germany, March 13, 2018—3D-Micromac AG, a leading supplier of laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, today unveiled its Clean Scribe technology, a new patent-pending feature for its microDICE™ laser micromachining system that enables particle-free scribing of silicon carbide (SiC) wafers without the need for expensive coatings and without impacting wafer dicing throughput.
3D-Micromac, TDMA and MOS technology host international laser and coating symposium 2018 focused on the future of the display industry
3D-Micromac AG, a leading supplier of laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, in cooperation with the Taiwan Flat Panel Display Materials and Device Association (TDMDA) and MOS Technology, will host the 6th International Laser and Coating Symposium (ILaCoS) on February 1, 2018 in Hsinchu, Taiwan.
3D-Micromac introduces microMARK MCF RXe 200, a system solution for laser marking of ophthalmic glasses
3D-Micromac‘s microMARK MCF RXe200 is a premium quality marking device for all kinds of blocked lenses. Equipped with an Excimer laser including an optimized optical components setup and a large-sized magnification ratio this new generation of RX marking devices offers an increased depth of focus at lowest laser power operation on all materials.