Production Solutions for Innovators and Growth Markets

Innovative laser processes are revolutionizing industrial manufacturing worldwide. They are characterized by extraordinary reliability, productivity, precision, and flexibility. It is only because of our laser processes that efficient series production of new and innovative components and products is possible. Our machine solutions are based on the highest technology. That’s why our systems are successfully utilized in high-tech industries and by innovators in the photovoltaic and semiconductor industries, micro diagnostics and failure analysis, display-and-smart glass production, electronics manufacturing, medical technology, and ophthalmic optics.

Semiconductor Industry Microdiagnostics Photovoltaics Glass and Display Industry

Semiconductor Industry

Cost, quality, and throughput are significant factors in achieving successful manufacturing in the semiconductor industry. With the growing adoption of new types of wafer substrates, thinner wafers, and scaling to smaller dimensions and larger-size substrates, wafer dicing is evolving as a critical value-added process step that not only ensures but also further enhances semiconductor device yields.

At the same time, traditional scaling of feature sizes in microelectronics is becoming increasingly cost-prohibitive to add more functionality to devices within a smaller footprint. As a result, chip manufacturers are looking for new methods to increase device performance. Among these is the use of thermal processing to modify the surface properties of the materials in the device.

Thermal annealing is a process used in the manufacturing of silicon carbide (SiC) power devices to improve their electrical properties and mechanical strength. This process is done by creating ohmic contact formation (OCF) on the backside of SiC wafers. However, as SiC devices continue to be made thinner to enhance their electrical performance and thermal management, the heat effects of thermal annealing on the backside of SiC wafers can have negative impacts on the active device structures on the front side of the wafer.

Selective laser annealing has also produced sensor elements based on Giant Magnetoresistance (GMR) and Tunneling Magnetoresistance (TMR) sensors. However, this approach requires multiple process steps to produce sensors with different magnetic orientations mounted in multi-chip packages or processed as integrated monolithic packages. New approaches to thermal annealing are needed to reduce these process steps, simplify the overall production flow, and enable more cost-effective production of integrated monolithic sensor packages.

3D-Micromac addresses these critical needs with its microDICE laser micromachining system leveraging TLS-Dicing (thermal laser separation) for wafer dicing and its two laser annealing systems: the microPRO XS laser annealing system for OCF and the microVEGA xMR laser annealing system for magnetic sensors.

Laser Annealing for Ohmic Contact Formation with microPRO™ XS OCF

High-throughput Laser Annealing System for Power Device Applications

Combining a state-of-the-art laser optic module with 3D-Micromac’s highly modular semiconductor wafer dicing platform, the microPRO XS OCF provides laser annealing with high repeatability and high throughput. The system features a UV-wavelength diode-pumped solid-state (DPSS) laser source with nano-second pulses and spot scanning to process the entire metalized backside of SiC wafers. It reduces particle generation due to process routine and chamber layout.—making it ideally suited for OCF in SiC power devices.

Laser Annealing for Integrated Magnetic Sensor Formation with microVEGA™ xMR

High-throughput, Selective Laser Annealing System for Monolithic Magnetic Sensor Applications

The microVEGA xMR is the first industrial annealing system for selective integrated magnetic sensor formation. Incorporating a highly flexible tool configuration with on-the-fly spot and variable laser energy, the system can accommodate both Giant Magnetoresistance (GMR) and Tunnel Magnetoresistance (TMR) sensors, as well as easily adjust the magnetic orientation, sensor position, and sensor dimension—making it an ideal solution for magnetic sensor production.

Learn more about our Selective Laser Annealing System for Monolithic Magnetic Sensors on our Laser Sensor Formation-Website.

High-Precision Laser Trimming for Link Cutting on Semiconductor Chips with microVEGA™ FC

High-throughput laser microprocessing for different applications in the semi industry

The microVEGA FC system performs high-throughput laser microprocessing for different applications in the semi-industry. The system combines high-precision processes with high dynamics. Therefore, possible applications include:

Programming of digital logic circuits,
Trimming of digital potentiometers,
Repairing semiconductor memory on chips
Removing of failure microLEDs.

Thanks to its highly flexible tool configuration, the microVEGA FC can accommodate both 200-mm and 300-mm wafers at processing speeds of up to 400 mm/s – making it an ideal production solution in terms of cost, throughput, yield, and sensitivity.

Laser Dicing with microDICE®

TLS-Dicing® System for Separation of Silicon and Silicon Carbide Wafers

The microDICE laser micromachining system leverages TLS-Dicing – a unique technology that uses thermally induced mechanical forces to separate brittle semiconductor materials, such as silicon (Si), silicon carbide (SiC), germanium (Ge) and gallium arsenide (GaAs), into dies with outstanding edge quality while increasing manufacturing yield and throughput. Compared to traditional separation technologies, such as saw dicing and laser ablation, TLS-Dicing enables a clean process, micro-crack-free edges, and higher resulting bending strength.

Capable of dicing speeds up to 300mm per second, the microDICE system provides up to a 10X increase in process throughput compared to traditional dicing systems. Its high throughput, outstanding edge quality, and 300-mm wafer-capable platform enable a high-volume production process, especially for SiC-based devices.

In addition, microDICE reduces the dicing cost per wafer by up to an order of magnitude or more compared to other wafer dicing approaches. Due to the contactless laser machining method, no tool wear and expensive consumables are required. This results in up to 15X lower cost of ownership over the entire lifetime of the dicing system.

Microdiagnostics and Failure Analysis

Microstructure diagnostics and failure analyses are pivotal for the ongoing improvement of functional materials and sophisticated electronic components. Although lasers are well established tools in manifold applications, they have been broadly ignored for use in sample preparation due to concerns regarding their potential for causing structural damage. Today, however, the use of ultrashort pulses and optimized processing routes is addressing these concerns and enabling laser processing to finally enter the scene – speeding up microstructure diagnostics and failure analysis as well as opening up access to deeply buried structures and large-area preparation.

New Vistas for Targeted and High-Throughput Material Analysis

microPREP™ PRO Workflows Provides Order of Magnitude Time and Cost Savings

Built on a highly flexible platform with a small table-top footprint, the microPREP PRO systems allow for easy integration into FA workflows. Developed jointly with Fraunhofer Institute for Microstructure of Materials and Systems (IMWS), the microPREP PRO system complements existing approaches to sample preparation such as focused ion beam (FIB) micromachining, offering up to 10,000 times higher ablation rates and therefore an order of magnitude lower cost of ownership (CoO) compared to FIB. As the first stand-alone, ultrashort pulsed laser-based tool for sample preparation, the microPREP PRO system brings additional unique capabilities, such as enabling large-area and 3D-shape sampling to allow for more comprehensive testing of complex structures.

The microPREP PRO system can be used for a variety of sample preparation techniques like SEM inspection of advanced-packaging devices, X-ray microscopy, atom probe tomography, and micro mechanics.

Photovoltaics Industry

The constant cost pressure in the photovoltaic industry as a continues challenge to solar cell manufacturers can only be solved by increasing cell efficiency with simultaneous reducing manufacturing costs. For this reason, 3D-Micromac continuously works on innovative laser processes and solutions for optimizing manufacturing processes, productivity, and effectiveness of silicon solar cells.

The microCELL production solutions, such as high performance laser processing for Laser Contact Opening (LCO) of high efficient PERC solar cells as well as laser dicing of full cells into half cells with Thermal Laser Separation (TLS-Dicing), are designed to meet cell manufacturers‘ demands for achieving maximum throughput rates and yield while diminishing cell manufacturing costs.

In addition, 3D-Micromac offers the powerful roll-to-roll processing microFLEX system for production of flexible thin-film solar cells. Besides the integration of laser processing, also printing and coating techniques can be integrated.

Cell Cutting to Increase PV Module Power with TLS-Dicing®

TLS-Technology Enables Outstanding Edge Quality and Superior Power Gain

Approved in the semiconductor industry for the separation of chips, 3D-Micromac has introduced the patented ultra-high-speed Thermal Laser Separation (TLS-Dicing) for particle free cutting of full size wafer into half cells or quarter cells. Unlike conventional cutting methods TLS-Dicing splits the solar cell with an unrivaled speed. The separated cells show a significantly higher mechanical strength, better edge quality and a lower power reduction compared to laser scribing and breaking approaches.

With more than 6,000 wafers per hour, the microCELL MCS laser system achieves the highest throughput on the market. At the same time, the microCELL MCS offers an unsurpassed level of flexibility in terms of possible cell layouts and the number of cell cuts: Whether half cells or shingle cells (third cells, quarter cells, or even sixth cells), the microCELL MCS cuts all common PV cell types with the highest edge quality.

With the industrially proven microCELL TLS laser system, the highest throughputs can be achieved in half-cell production. The on-the-fly processing guarantees the highest productivity and an outstanding price-performance ratio. The fully automated 24/7 system is available as a stand-alone or inline system.

Roll-to-roll Laser Processing of Flexible Solar Cells

High-Throughput Processing of Thin-film PV Cells with microFLEX®

With the microFLEX PV roll-to-roll machining systems we provide powerful and highly precise laser structuring of flexible and organic thin-film solar cells. The continouous on-the-fly processing ensures high machinings speed. Numerous process monitoring methods, including tracking and tracing of process parameters and online energy monitoring, ensure additional process reliability. The modular machine concept makes microFLEX suitable for industrial mass production, pilot lines as well as applied research in the photovoltaics industry.

3D-Micromac’s microFLEX PV - R2R laser system for thin-film PV cells

Powerful Laser Structuring of PERC Solar Cells

microCELL™ OTF for Laser Contact Opening

Using its extensive expertise on laser processing 3D-Micromac has developed the microCELL OTF as the most cost-effective solution for laser backside contact opening in the market.

The highly productive laser system microCELL OTF meets cell manufacturers‘ demands for increasing the cell efficiency by precise surface structuring, low operating costs, and highest availability. Laser processing on-the-fly and an innovative handling concept enable maximum throughput and yield in the mass production of crystalline solar cells. The contactless cell handling enables processing without surface defects and microcracks. microCELL OTF is available for both new production lines and upgrading of existing cell production lines.

Excellent Support and Service

The experienced 3D-Micromac employees understand solar manufacturers’ requests and are familiar with the way of working in a modern 24/7 production environment with high reliability in mind.

3D-Micromac’s worldwide network of engineers and service partners support customers throughout the lifecycle of the laser systems. In addition, 3D-Micromac has a fully equipped application laboratory with experienced process engineers to support customers in feasibility tests, process development, and realization of customized solutions. This immensely helps to reduce ramp-up times in production.

Display and Smart Glasses

Glass materials such as borosilicate, aluminum silicate (e.g. Gorilla®), quartz and other types of specialty glass are used in many applications due to their unique properties such as thermal and dimensional stability, surface quality, hermeticity, process compatibility and optical performance and as flat and hollow glasses in many industries.

In order to process the glass materials, many manufacturers now use laser technology. Laser processing of glass enables rapid, highly precise and highly reproducible processing of brittle glass substrates. Compared to conventional processing methods, laser processing scores with:

Free-form geometries
Internal contours
Best surfaces- and edge quality
Minimal chipping
Possibility for processing coated substrates
No masks, wear parts and other expedients necessary

The processes range from laser cutting through the production of filaments/modifications, laser drilling up to layer-by-layer ablation to the manufacturing of 3D structures. In addition, the laser is ideally suited for removing coatings thanks to its high selectivity. Furthermore, laser engravings can be generated on the surface or inside the material.

The processing of the glass materials takes mostly place in the form of round substrates such as wafers all the way to large-area panels. Increasing the production throughput requires the processing of ever larger panels or even the conversion of wafer processing to panel processing.

Typically, in industrial applications, rigid glasses with a thickness of greater than 0.3 mm are used. Currently, the latest developments are being pushed towards thinner and more flexible substrates. This trend offers the opportunity for new applications and designs. For manufacturers, this means above all the conversion to new and flexible production technologies.

With the microSHAPE laser systems, 3D-Micromac offers unique processing technologies and innovative process management for the cost-effective and high-quality processing of wafers and large glass substrates. All processes meet the requirements of industrial customers and guarantee clean and gentle processing as well as excellent processing quality.

Interested in our laser solutions for glass processing? Please visit:

https://laserglasscutting.com/

microSHAPE™ – Laser System for Processing of Flat Glass

The microSHAPE laser system is a modular platform for the precise and highly dynamic processing of glass panels up to panel sizes of Gen 8.5 and various applications, for example:

Production of displays:

Laser cutting of cover glass and coated glass
Cutting of carrier substrates made of glass, for example OLED carrier
Laser drilling of vias

Life-Science

Laser cutting of glasses for medical and optical diagnostics
Cutting biochips or high performance slide

Semiconductors, electronics and sensors

Laser cutting or separating glass substrates or wafers into chips
Cutting coated substrates
Processing vias

microPOLAR™ – Laser Processing System for AR Waveguide Cutting

3D-Micromac’s brand-new microPOLAR uses an innovative laser glass-cutting process that was specially designed to process high-index glasses and other transparent crystalline materials. Therefore, it is ideal for wafer-based separation and singulation of augmented reality (AR) eyepieces and waveguides.

The fully integrated microPOLAR laser system is characterized by its compact footprint and high variability. It is in-field-upgradable, thus fitting R&D purposes, as well as enabling mass production with high yield.

The microPOLAR enables the separation and cutting of AR waveguides and eyepieces with the highest bending strength after the singulation of the glasses. This ensures the cost-effective production of AR waveguides and eyepieces – while staying flexible in regard to lot sizes and shapes.