Successful completion of the EU-funded project “HighLite”
Successful completion of the EU-funded project “HighLite”
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3D-Micromac introduces microMARK™ RXe BLUE for laser engraving of ophthalmic glasses
3D-Micromac introduces microMARK RXe BLUE for laser engraving of ophthalmic glasses
Change in Management of 3D-Micromac America, LLC
Change in Management: Brian Hoekstra has withdrawn from his position as 3D-Micromac America, LLC manager.
3D-Micromac unveils laser based high-volume preparation solution for semiconductor and materials failure analysis
Chemnitz, Germany, July 9, 2018—3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device and electronics markets, today introduced the microPREP™ 2.0 laser ablation system for high-volume sample preparation of metals, semiconductors, ceramics and compound materials for microstructure diagnostics and failure analysis (FA).
3D-Micromac introduces selective laser annealing system for semiconductor, power device and MEMS manufacturing
Chemnitz, Germany, June 25, 2018—3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device and electronics markets, today unveiled the microPRO™ RTP—its new laser annealing system designed to enable several key process steps in semiconductor, power device and MEMS manufacturing. Combining a state-of-the-art laser optic module with 3D-Micromac’s modular semiconductor wafer processing platform, the microPRO RTP provides selective annealing with high repeatability and throughput in a versatile system.
3D-Micromac shows microFLEX laser system for processing of flexible solar cells at SNEC 2018
3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, is presenting its high-throughput microFLEX laser systems for processing of flexible solar cells at the SNEC 2018 International Photovoltaic Power Generation Conference & Exhibition, to be held on May 28th-30th in Shanghai, China.
3D-Micromac receives order for new microMIRA excimer laser lift-off system from dpiX for X-ray sensor manufacturing
Chemnitz, Germany, May 16, 2018—3D-Micromac AG, a leading supplier of laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, today announced it has received an order for the company’s new microMIRA excimer laser lift-off (LLO) system from dpiX, a leading manufacturer of high-resolution digital sensors. The microMIRA system will be shipped to dpiX’s fab in Colorado Springs, Colo., where it will provide laser lift-off processing from Gen 4.5 glass substrates used in manufacturing X-ray sensors for medical, industrial and military applications.
3D-Micromac unveils clean scribe technology on microDICE TLS laser dicing system for low-cost, particle-free dicing of silicon carbide wafers
Chemnitz, Germany, March 13, 2018—3D-Micromac AG, a leading supplier of laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, today unveiled its Clean Scribe technology, a new patent-pending feature for its microDICE™ laser micromachining system that enables particle-free scribing of silicon carbide (SiC) wafers without the need for expensive coatings and without impacting wafer dicing throughput.