Laser Lift-Off System

3D-Micromac’s brand-new microMIRA Laser Lift-Off (LLO) system provides highly uniform, force-free lift-off of flexible layers on wafers and large surface areas (up to GEN6) and at high speeds. The system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer’s unique requirements.

The microMIRA system can be used for a variety of applications, such as device lift-off from glass and sapphire substrates in semiconductor manufacturing as well as OLED and microLED display manufacturing. Additional applications include laser annealing and crystallization for surface modification.

microMIRA™ provides the following benefits:

  • Force-free and extremely selective laser processing
  • No damage due to thermo-mechanical effects
  • Low production costs
  • Elimination of costly and polluting wet chemical processes
  • Integration of adjacent manufacturing steps for greater fab productivity

Please contact us for more information!

Jan Klinger
Head of Sales and Product Management

+49 (0)371 40043-66 / -228

Das Team Sales & Product Management