Meet 3D-Micromac at ISTFA 2021 in Phoenix, Arizona!
The “International Symposium for Testing and Failure Analysis” (short: ISTFA) is one of the most important industry events for everyone performing failure analysis in the field of microelectronics. ISTFA will be held for the 47th time this year. From October 31 to November 4, 2021 ISTFA offers a variety of workshops and lectures, which are accompanied by an industrial exhibition.
3D-Micromac will present the microPREP™ PRO system, which enables uncomplicated laser-based sample processing, at the accompanying trade exhibition.
We are looking forward to meeting you there. You will find us at booth 600.