Visit 3D-Micromac AG at SEMICON West 2021 in San Francisco, USA.
SEMICON West attracts a highly qualified and technologically focused audience from the semiconductor industry every year. Business and technology leaders, researchers and industry analysts from across the microelectronics sector will gather on the show floor from 7 to 9 December 2021.
3D-Micromac is going to exhibit laser micromachining solutions that address critical needs of semiconductor processing:
- microVEGA™ xMR – laser annealing system for monolithic magnetic sensor formation
- microPRO™ XS OCF – laser system for ohmic contact formation of SiC power devices
- microPREP™ PRO for laser-based sample preparation in microstructure diagnostics
- microDICE™ – wafer dicing system using TLS-Dicing®
- and many more enabling laser micromachining solutions, e.g. for microLED and AR device processing
We look forward to meeting you at our booth no 367.