3D-Micromac unveils laser based high-volume preparation solution for semiconductor and materials failure analysis

Chemnitz, Germany, July 9, 2018—3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device and electronics markets, today introduced the microPREP™ 2.0 laser ablation system for high-volume sample preparation of metals, semiconductors, ceramics and compound materials for microstructure diagnostics and failure analysis (FA).

3D-Micromac introduces selective laser annealing system for semiconductor, power device and MEMS manufacturing

Chemnitz, Germany, June 25, 2018—3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device and electronics markets, today unveiled the microPRO™ RTP—its new laser annealing system designed to enable several key process steps in semiconductor, power device and MEMS manufacturing. Combining a state-of-the-art laser optic module with 3D-Micromac’s modular semiconductor wafer processing platform, the microPRO RTP provides selective annealing with high repeatability and throughput in a versatile system.

3D-Micromac shows microFLEX laser system for processing of flexible solar cells at SNEC 2018

3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, is presenting its high-throughput microFLEX laser systems for processing of flexible solar cells at the SNEC 2018 International Photovoltaic Power Generation Conference & Exhibition, to be held on May 28th-30th in Shanghai, China.

3D-Micromac receives order for new microMIRA excimer laser lift-off system from dpiX for X-ray sensor manufacturing

Chemnitz, Germany, May 16, 2018—3D-Micromac AG, a leading supplier of laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, today announced it has received an order for the company’s new microMIRA excimer laser lift-off (LLO) system from dpiX, a leading manufacturer of high-resolution digital sensors. The microMIRA system will be shipped to dpiX’s fab in Colorado Springs, Colo., where it will provide laser lift-off processing from Gen 4.5 glass substrates used in manufacturing X-ray sensors for medical, industrial and military applications.

3D-Micromac unveils clean scribe technology on microDICE TLS laser dicing system for low-cost, particle-free dicing of silicon carbide wafers

Chemnitz, Germany, March 13, 2018—3D-Micromac AG, a leading supplier of laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, today unveiled its Clean Scribe technology, a new patent-pending feature for its microDICE™ laser micromachining system that enables particle-free scribing of silicon carbide (SiC) wafers without the need for expensive coatings and without impacting wafer dicing throughput.

3D-Micromac, TDMA and MOS technology host international laser and coating symposium 2018 focused on the future of the display industry

3D-Micromac AG, a leading supplier of laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, in cooperation with the Taiwan Flat Panel Display Materials and Device Association (TDMDA) and MOS Technology, will host the 6th International Laser and Coating Symposium (ILaCoS) on February 1, 2018 in Hsinchu, Taiwan.

3D-Micromac introduces microMARK MCF RXe 200, a system solution for laser marking of ophthalmic glasses

3D-Micromac‘s microMARK MCF RXe200 is a premium quality marking device for all kinds of blocked lenses. Equipped with an Excimer laser including an optimized optical components setup and a large-sized magnification ratio this new generation of RX marking devices offers an increased depth of focus at lowest laser power operation on all materials.

3D-Micromac is manufacturer of choice for laser contact opening systems for PERC solar cell production at Hanwha SolarOne

3D-Micromac AG, a leading supplier of laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, today announced that it has installed three of its microCELL OTF laser systems at Hanwha SolarOne’s production facility in Qidong, Jiangsu-province, China. The successful installation was followed by an additional order of a fourth laser system to support the conversion of Hanwha SolarOne’s aluminum back surface field (Al-BSF) technology production to high-efficiency Passivated Emitter Rear Contact (PERC) solar cells.

3D-Micromac extends board of directors

The supervisory board of 3D-Micromac AG has appointed Uwe Wagner to the board of directors. Since October 1, 2017, he has been supporting Tino Petsch, the only member of the board to date. Uwe Wagner now is responsible for the technological and commercial management of the German laser specialist.

3D-Micromac introduces selective laser annealing system for semiconductor, power device and mems manufacturing

Chemnitz, Germany, September 18, 2017—3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, today unveiled the microPRO RTP—its new laser annealing system designed to enable several key process steps in semiconductor, power device and MEMS manufacturing.